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THGBMBG5D1KBAIL PDF Datasheet Search Results

No Part number Description ( Function ) Manufacturers PDF
1 THGBMBG5D1KBAIL
4GB density of e-MMC Module

THGBMBG5D1KBAIL 4GB THGBMBG5D1KBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMBG5D1KBAIL has an industry standard MMC protocol for easy use. FEATURES THGBMBG5D1KBAIL Interface THGB

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It can be published by the manufacturer to help people choose products or to help use the products.


THGBMBG5D1KBA Data sheets

Part No Description ( Function) Manufacturers PDF
THGBMBG5D1KBAIL   4GB density of e-MMC Module

THGBMBG5D1KBAIL 4GB THGBMBG5D1KBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMBG5

Toshiba
Toshiba
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