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RM0 PDF Datasheet Search Results

No Part number Description ( Function ) Manufacturers PDF
7 RM0
RoHS Compliant SMPS Stacked MLC Capacitors

RoHS Compliant SMPS Stacked MLC Capacitors (RM Style) Technical Information on SMPS Capacitors ELECTRICAL SPECIFICATIONS Temperature Coefficient C0G: A Temperature Coefficient - 0 ±30 ppm/°C, -55° to +125°C X7R: C Temperature Coefficient - ±15%, -55° to +125°C Z5U: E Temperature Coefficient - +22, -56%, +10° to +85°C Capacitance Test (MIL-STD-202 Method 305) C0G: 25°C

AVX
AVX
pdf
6 RM0008
Reference manual

RM0008 Reference manual STM32F101xx, STM32F102xx, STM32F103xx, STM32F105xx and STM32F107xx advanced ARM®-based 32-bit MCUs Introduction This reference manual targets application developers. It provides complete information on how to use the STM32F101xx, STM32F102xx, STM32F103xx and STM32F105xx/STM32F107xx microcontroller memory and peripherals. The STM32F101xx, STM32F102xx, ST

STMicroelectronics
STMicroelectronics
pdf
5 RM0016
STM8S and STM8AF microcontroller families

RM0016 Reference manual STM8S and STM8AF microcontroller families Introduction This reference manual provides complete information for application developers on how to use STM8S and STM8AF microcontroller memory and peripherals. The STM8AF is a family of microcontrollers designed for automotive applications, with different memory densities, packages and peripherals:  The lo

STMicroelectronics
STMicroelectronics
pdf
4 RM0033
advanced ARM-based 32-bit MCUs Reference manual

RM0033 Reference manual STM32F205xx, STM32F207xx, STM32F215xx and STM32F217xx advanced ARM-based 32-bit MCUs Introduction This reference manual targets application developers. It provides complete information on how to use the STM32F205xx, STM32F207xx, STM32F215xx and STM32F217xx microcontroller memory and peripherals. The STM32F205xx, STM32F207xx, STM32F215xx and STM32F217xx w

STMicroelectronics
STMicroelectronics
pdf
3 RM008
PA Module

RM008 PA Module for Dual-band GSM900 and DCS1800 Applications The RM008 is a dual-band Power Amplifier Module (PAM) designed in a compact form factor for Class 4 GSM900 and Class 1 DCS1800 operation. The PAM consists of two Gallium Arsenide (GaAs) Heterojunction Bipolar Transistor (HBT) power amplifiers and internal components that match the RF input and ou

SKYWORKS
SKYWORKS
pdf
2 RM009
Power Amplifier Module

RM009 Power Amplifier Module for Dual-band GSM900 DCS1800 The RM009 is a dual-band Power Amplifier Module (PAM) designed in a compact Distinguishing Features form factor for Class 4 GSM900 and Class 1 DCS1800 cellular handsets. • High efficiency GSM 54% DCS 45% Input/output matching 50 Ω internal Small outline 9.1 mm x 11.6 mm Low profile 1.50 mm ±10%

SKYWORKS
SKYWORKS
pdf


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