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Datasheet QFP-T80 Equivalent ( PDF ) |
N.º | Número de pieza | Descripción | Fabricantes | Category |
1 | QFP-T80 | LSI Assembly
LSI Assembly
QFP80/QFP-T80
(Units : mm)
• QFP80/QFP-T80
24.0 20.0
80 81 51 50
18.0
14.0
100 1 30
31
H=2.85Max. / 2.85Max.
The contents described herein are subject to change without notice.
DataSheet 4 U .com
Appendix
Notes
No technical content | ROHM Semiconductor | data |
QFP Datasheet ( Hoja de datos ) - resultados coincidentes |
N.º | Número de pieza | Descripción | Fabricantes | Catagory |
1 | QFP-A64 | LSI Assembly
LSI Assembly
QFP-A64
(Units : mm)
• QFP-A64
16.4 14.0
48 49 33 32
16.4
14.0
64 1 16
17
H=2.85Max.
The contents described herein are subject to change without notice.
DataSheet 4 U .com
Appendix
Notes
No technical content pages of this document m ROHM Semiconductor data | | |
2 | QFP-EP | Exposed Pad Quad Flat Pack
QFP-ep
Exposed Pad Quad Flat Pack
• 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm
FEATURES
• Body Sizes: 7 x 7mm to 24 x 24mm • Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep) • Lead Counts: 32L to 216L • Lead STATS ChipPAC data | | |
3 | QFP-SD | Stacked Die Quad Flat Pack
QFP-SD
Stacked Die Quad Flat Pack
• Stacking of die enables more functionality and integration in a conventional QFP package
FEATURES
• Combining devices into one package reduces PCB real estate and cost • Increased sub-system performance by integrating multiple chips int STATS ChipPAC data | | |
4 | QFP-T80 | LSI Assembly
LSI Assembly
QFP80/QFP-T80
(Units : mm)
• QFP80/QFP-T80
24.0 20.0
80 81 51 50
18.0
14.0
100 1 30
31
H=2.85Max. / 2.85Max.
The contents described herein are subject to change without notice.
DataSheet 4 U .com
Appendix
Notes
No technical content ROHM Semiconductor data | | |
5 | QFP44 | POD Target Layout _
Adapters
V1.2
QFP44 – T_PLCC44 POD target layout
Target CPU package: QFP44 Body size: 10 mm x 10 mm Pitch: 0.8 mm POD target layout: T_PLCC44 Can be used with: • Philips H-8xC52 POD • Atmel 89C51CC POD • EH-C513 POD • 68HC05C9 POD • 68HC11D3E POD • 68HC11D3S POD Note that adapter s iSYSTEM data | | |
6 | QFP44 | TET _
Adapters
V1.1
QFP44 - TET
Target CPU package: QFP44 Body size: 10 mm x 10 mm Pitch: 0.8 mm POD target layout: T_QFP64 Can be used with: • ST72F561 POD Note that adapter solutions stated in the document can be used only with listed PODs. Disregarding this warning may result in hardware failure iSYSTEM data | | |
7 | QFP44 | LSI Assembly LSI Assembly
QFP44
(Units : mm)
• QFP44
14.0 10.0
33 23 22 12 1 11 34 44
14.0
10.0
H=2.3Max.
w
w
w
.d
e e h s a t a
. u t4
m o c
The contents described herein are subject to change without notice.
Appendix
Notes
No technical content pages of this document may b ROHM Semiconductor data | |
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Número de pieza | Descripción | Fabricantes | |
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