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Datasheet QFP-T80 Equivalent ( PDF )

N.º Número de pieza Descripción Fabricantes Category
1QFP-T80LSI Assembly

LSI Assembly QFP80/QFP-T80 (Units : mm) • QFP80/QFP-T80 24.0 20.0 80 81 51 50 18.0 14.0 100 1 30 31 H=2.85Max. / 2.85Max. The contents described herein are subject to change without notice. DataSheet 4 U .com Appendix Notes No technical content
ROHM Semiconductor
ROHM Semiconductor
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QFP Datasheet ( Hoja de datos ) - resultados coincidentes

N.º Número de pieza Descripción Fabricantes Catagory
1QFP-A64LSI Assembly

LSI Assembly QFP-A64 (Units : mm) • QFP-A64 16.4 14.0 48 49 33 32 16.4 14.0 64 1 16 17 H=2.85Max. The contents described herein are subject to change without notice. DataSheet 4 U .com Appendix Notes No technical content pages of this document m
ROHM Semiconductor
ROHM Semiconductor
data
2QFP-EPExposed Pad Quad Flat Pack

QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES • Body Sizes: 7 x 7mm to 24 x 24mm • Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep) • Lead Counts: 32L to 216L • Lead
STATS ChipPAC
STATS ChipPAC
data
3QFP-SDStacked Die Quad Flat Pack

QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP package FEATURES • Combining devices into one package reduces PCB real estate and cost • Increased sub-system performance by integrating multiple chips int
STATS ChipPAC
STATS ChipPAC
data
4QFP-T80LSI Assembly

LSI Assembly QFP80/QFP-T80 (Units : mm) • QFP80/QFP-T80 24.0 20.0 80 81 51 50 18.0 14.0 100 1 30 31 H=2.85Max. / 2.85Max. The contents described herein are subject to change without notice. DataSheet 4 U .com Appendix Notes No technical content
ROHM Semiconductor
ROHM Semiconductor
data
5QFP44POD Target Layout

_ Adapters V1.2 QFP44 – T_PLCC44 POD target layout Target CPU package: QFP44 Body size: 10 mm x 10 mm Pitch: 0.8 mm POD target layout: T_PLCC44 Can be used with: • Philips H-8xC52 POD • Atmel 89C51CC POD • EH-C513 POD • 68HC05C9 POD • 68HC11D3E POD • 68HC11D3S POD Note that adapter s
iSYSTEM
iSYSTEM
data
6QFP44TET

_ Adapters V1.1 QFP44 - TET Target CPU package: QFP44 Body size: 10 mm x 10 mm Pitch: 0.8 mm POD target layout: T_QFP64 Can be used with: • ST72F561 POD Note that adapter solutions stated in the document can be used only with listed PODs. Disregarding this warning may result in hardware failure
iSYSTEM
iSYSTEM
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7QFP44LSI Assembly

LSI Assembly QFP44 (Units : mm) • QFP44 14.0 10.0 33 23 22 12 1 11 34 44 14.0 10.0 H=2.3Max. w w w .d e e h s a t a . u t4 m o c The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may b
ROHM Semiconductor
ROHM Semiconductor
data



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Número de pieza Descripción Fabricantes PDF
SPS122

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Sanken
Sanken
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