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Datasheet DIP24 Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | |
| 5 | DIP24 | Thermal Data ®
Thermal Data
DIP 24
24 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.25 mm 10-40 µm
molding compound
3 mm
0.0063W/cm°C
Charts enclosed : 1) Rth(j-a) vs power d |
 STMicroelectronics |
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| 4 | DIP24-1A72-11 | (DIP Series) Molded DIP Reed Relays
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays.
CHARACTERISTICS
• Low profile package • Standard pin configuratio |
 MEDER |
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| 3 | DIP24-1Axx-xx | (DIP Series) Molded DIP Reed Relays
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays.
CHARACTERISTICS
• Low profile package • Standard pin configuratio |
MEDER |
|
| 2 | DIP24-1Bxx-xx | (DIP Series) Molded DIP Reed Relays
MEDER electronic
DIP Series
Molded DIP Reed Relays
DESCRIPTION
The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays.
CHARACTERISTICS
• Low profile package • Standard pin configuratio |
MEDER |
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