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Datasheet CPS Equivalent ( PDF ) |
| N.º | Número de pieza | Descripción | Fabricantes | |
| 23 | CPS041 | Silicon Controlled Rectifier Sensitive Gate SCR Chip PROCESS
CPS041
Silicon Controlled Rectifier
Sensitive Gate SCR Chip
PROCESS DETAILS Process Die Size Die Thickness Cathode Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization
GLASS PASSIVATED MESA 41 x 41 MILS 8.7 MILS ± 0.6 MILS 18 x 8 MILS 7 |
 Central Semiconductor |
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| 22 | CPS053 | Silicon Controlled Rectifier Sensitive Gate SCR Chip PROCESS
CPS053
Silicon Controlled Rectifier
2.0 Amp Sensitive Gate SCR Chip
PROCESS DETAILS Process Die Size Die Thickness Cathode Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization
Glass Passivated Mesa 53 x 53 MILS 8.7 MILS 20 x 10 MILS 7.9 |
Central Semiconductor |
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| 21 | CPS05641AB | Display Module Wuxi Compul Electronics Co,.Ltd
Mail: [email protected] Web: www.compul.cn Tel: 86 510 87359088 Fax: 86 510 87359268
CPS05641AB
Package Dimensions
Internal Circuit Diagram
5641A
Four Digits Displays Series
5641B
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 Wuxi Compul Electronics |
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| 20 | CPS057 | Silicon Controlled Rectifier Sensitive Gate SCR Chip PROCESS
CPS057
Silicon Controlled Rectifier
Sensitive Gate SCR Chip
PROCESS DETAILS Process Die Size Die Thickness Cathode Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization
GLASS PASSIVATED MESA 57 x 57 MILS 8.7 MILS ± 0.6 MILS 24 x 14 MILS |
Central Semiconductor |
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