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What is SS56?

This electronic component, produced by the manufacturer "WEJ", performs the same function as "5.0A Surface Mount Schottky Barrier".


SS56 Datasheet PDF - WEJ

Part Number SS56
Description 5.0A Surface Mount Schottky Barrier
Manufacturers WEJ 
Logo WEJ Logo 


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66-66
5.0A Surface Mount Schottky Barrier
Rectifiers - 20V-200V
Features
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
Low power loss, high efficiency.
High current capability, low forward voltage drop.
High surge capability.
Guardring for overvoltage protection.
Ultra high-speed switching.
Silicon epitaxial planar chip, metal silicon junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Suffix "-H" indicates Halogen-free parts, ex. FΜ520-H.
Mechanical data
Epoxy:UL94-V0 rated flame retardant
Case : Molded plastic, DO-214AB / SMC
Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
Polarity : Indicated by cathode band
Mounting Position : Any
Weight : Approximated 0.19 gram
Package outline
SMC
0.272(6.9)
0.248(6.3)
0.012(0.3) Typ.
0.189(4.8)
0.165(4.2)
0.048(1.2) Typ.
0.098(2.5)
0.075(1.9)
0.048 (1.2) Typ.
Dimensions in inches and (millimeters)
Maximum ratings and Electrical Characteristics (AT TA=25oC unless otherwise noted)
PARAMETER
CONDITIONS
Symbol MIN. TYP. MAX.
Forward rectified current
See Fig.1
IO 5.0
UNIT
A
Forward surge current
8.3ms single half sine-wave (JEDEC methode)
IFSM
150 A
Reverse current
Thermal resistance
Diode junction capacitance
Storage temperature
VR = VRRM TJ = 25OC
VR = VRRM TJ = 100OC
Junction to ambient
Junction to case
f=1MHz and applied 4V DC reverse voltage
IR
RθJA
RθJC
CJ
TSTG
0.5
mA
20
32 OC/W
16 OC/W
380 pF
-65 +175 OC
SYMBOLS
SS52
SS53
SS54
SS55
SS56
SS58
SS510
SS515
SS520
V
R
*
RM
1
(V)
20
30
40
50
60
80
100
150
200
V
*
RMS
2
(V)
14
21
28
35
42
56
70
105
140
V
*
R
3
(V)
20
30
40
50
60
80
100
150
200
V
*
F
4
(V)
0.55
0.70
0.85
0.90
0.92
Operating
temperature
TJ, (OC)
-55 to +125
-55 to +150
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage@IF=5.0A
WEJ ELECTRONIC CO./7' Http:// www.wej.cn E-mail:wej@yongerjia.com

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SS56 equivalent
66-66
Reel packing
PACKAGE
REEL SIZE
SMC
13"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
3,000
8.0
BOX
(pcs)
INNER
BOX
(m/m)
6,000 337*337*37
REEL
DIA,
(m/m)
330
CARTON
SIZE
(m/m)
350*330*360
CARTON
(pcs)
48,000
APPROX.
GROSS WEIGHT
(kg)
17.2
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5oC~40oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Tp
TP
Ramp-up
Critical Zone
TL to TP
TL
Ts m a x
TL
Ts m i n
tS
Preheat
Ramp-down
25
t25oC to Peak
3.Reflow soldering
Time
Profile Feature
Average ramp-up rate(TL to TP)
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(ts)
Tsmax to TL
-Ramp-upRate
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(TP)
Time within 5oC of actual Peak
Temperature(tP)
Ramp-down Rate
Time 25oC to Peak Temperature
Soldering Condition
<3oC/sec
150oC
200oC
60~120sec
<3oC/sec
217oC
60~260sec
255oC-0/+5oC
10~30sec
<6oC/sec
<6minutes
WEJ ELECTRONIC CO./7' Http:// www.wej.cn E-mail:wej@yongerjia.com


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