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PDF S-LNTK3043PT5G Data sheet ( Hoja de datos )
| Número de pieza | S-LNTK3043PT5G | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | LRC | |
| Logotipo |  |
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LESHAN RADIO COMPANY, LTD.
Power MOSFET
20 V, 285 mA, P−Channel with ESD
Protection, SOT−723
Features
• Enables High Density PCB Manufacturing
• 44% Smaller Footprint than SC−89 and 38% Thinner than SC−89
• Low Voltage Drive Makes this Device Ideal for Portable Equipment
• Low Threshold Levels, VGS(TH) < 1.3 V
• Low Profile (< 0.5 mm) Allows It to Fit Easily into Extremely Thin
Environments such as Portable Electronics
• Operated at Standard Logic Level Gate Drive, Facilitating Future
Migration to Lower Levels Using the Same Basic Topology
• These are Pb−Free Devices
• S- Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC-Q101 Qualified and
PPAP Capable.
Applications
• Interfacing, Switching
• High Speed Switching
• Cellular Phones, PDAs
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value
Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady
State
tv5s
Steady
State
tv5s
TA = 25°C
TA = 85°C
TA = 25°C
TA = 25°C
VDSS
VGS
ID
PD
20 V
±10 V
255
185 mA
285
440
mW
545
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
TA = 25°C
TA = 85°C
TA = 25°C
ID
PD
210
mA
155
310 mW
Pulsed Drain Current
tp = 10 ms
IDM
Operating Junction and Storage Temperature TJ, TSTG
400
−55 to
150
mA
°C
Source Current (Body Diode) (Note 2)
IS 286 mA
Lead Temperature for Soldering Purposes
(1/8” from case for 10 seconds)
TL
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces)
2. Surface−mounted on FR4 board using the minimum recommended pad size.
LNTK3043PT5G
S-LNTK3043PT5G
V(BR)DSS
20 V
RDS(on) TYP
1.5 W @ 4.5 V
2.4 W @ 2.5 V
5.1 W @ 1.8 V
6.8 W @ 1.65 V
Top View
3
ID Max
285 mA
12
1 − Gate
2 − Source
3 − Drain
MARKING
DIAGRAM
SOT−723
CASE 631AA
KB
1
KB = Device Code
M = Date Code
ORDERING INFORMATION
Device
LNTK3043PT5G
S-LNTK3043PT5G
Package
Shipping †
SOT−723* 8000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
Rev .O 1/5
1 page  
LESHAN RADIO COMPANY, LTD.
LNTK3043PT5G , S-LNTK3043PT5G
PACKAGE DIMENSIONS
SOT−723
−X−
D
b1
−Y−
3
12
E
A
L HE
b 2X
e 0.08 (0.0032) X Y
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.45 0.50 0.55 0.018 0.020 0.022
b 0.15 0.21 0.27 0.0059 0.0083 0.0106
b1 0.25 0.31 0.37 0.010 0.012 0.015
C 0.07 0.12 0.17 0.0028 0.0047 0.0067
D 1.15 1.20 1.25 0.045 0.047 0.049
E 0.75 0.80 0.85 0.03 0.032 0.034
e 0.40 BSC
0.016 BSC
H E 1.15 1.20 1.25 0.045 0.047 0.049
L 0.15 0.20 0.25 0.0059 0.0079 0.0098
SOLDERING FOOTPRINT*
0.40
0.0157
0.40
0.0157
1.0
0.039
0.40
0.0157
0.40
0.0157
0.40
0.0157
SCALE 20:1
ǒ mm Ǔ
inches
Rev .O 5/5
5 Page | ||
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| PDF Descargar | [ Datasheet S-LNTK3043PT5G.PDF ] | |
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