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PDF CP604 Data sheet ( Hoja de datos )

Número de pieza CP604
Descripción SINGLE-PHASE SILICON BRIDGE-P.C. MTG 3A / HEAT-SINK MTG 6A(VOLTAGE 50 to 1000 Volts CURRENT - P.C. MTG 3A / HEAT-SINK MTG 6A)
Fabricantes Pan Jit International Inc. 
Logotipo Pan Jit International Inc. Logotipo



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DATA SHEET
CP600~CP6010
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 3A , HEAT-SINK MTG 6A
VOLTAGE 50 to 1000 Volts CURRENT - P.C. MTG 3A , HEAT-SINK MTG 6A
Recongnized File # E111753
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O .
• Surge Overload Ratings to 125 Amperes.
• Low forward voltage, and reverse leakage.
• Small size , simple installation.
• Reliable low cost construction utilizing molded plastic technique.
.15(3.8) MIN
.044(1.1)
.039(1.0)
MECHANICALDATA
Mounting Position: Any
Weight: 0.2 ounce, 5.6 gram
Terminals: Lead solderable per MIL-STD-202 Method 208
Mounting Torque: 5 in. lb. max.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Single phase , half wave ,60Hz, resistive or inductive load.
For capacitive load , derate current by 20%.
.445(11.3)
.406(10.3)
.618(15.7)
.579(14.7)
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Bridge input Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Current at TC=50°C
See Fig 2
at TA=25°C
Peak Forward Surge Current ,8.3ms
single half sine-wave superimposed on rated load
CP600
50
35
50
CP601 CP602
100 200
70 140
100 200
CP604
400
280
400
6
3
125
CP606
600
420
600
CP608 CP6010 UNITS
800 1000
V
560 700
V
600 1000
V
A
A
Maximum Forward Voltage per Bridge Element
Specified Current at 3.0A DC & 25°C.See Fig 3
1.1 V
Maximum Reverse Leakage at RatedDC Blocking
Voltage per element.
at 25°C
See Fig 4
at 100°C
I2t Rating for fusing ( t < 8.35 ms)
Typical junction capacitance per leg (NOTE 4)CJ
Typical Thermal resistance per leg ( NOTE 3) RθJA
Typical Thermal resistance per leg ( NOTE 2) RθJC
Operating Temperature Range TJ
Storage Temperature Range TA
10.0
1.0
127
186
22.0
7.3
-55 to +125
-55 to +150
µA
mA
A2S
pF
°C/W
°C
°C
NOTES:
1.Bolt down on heat-sink with silicon thermal compound between bridge and mounting surface for maximum heat transfer with #6 screw.
2.Unit mounted on 5.0 X 6.0 X 0.11” thick ( 14 X 15 X 0.3 cm )AL.plate.
3.Unit mounted on P.C.B at 0.395”(9.5mm)lead length with 0.5 X 0.5” ( 12 X 12 mm )copper pads.
4.Measured at 1.0MHZ and applied reverse voltage of 4.0 volts.

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