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PDF 1SS400Y2 Data sheet ( Hoja de datos )
| Número de pieza | 1SS400Y2 | |
| Descripción | High Speed Switching diode | |
| Fabricantes | CYStech | |
| Logotipo |  |
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CYStech Electronics Corp.
High Speed Switching diode
1SS400Y2
Spec. No. : C303Y2
Issued Date : 2011.05.16
Revised Date :
Page No. : 1/5
Features
•Extremely small surface mounting type.(SOD723)
•High speed switching applications
•Low reverse current
Symbol
Outline
SOD-723
Absolute Maximum Ratings(TA=25°C)
• Maximum Temperatures
Storage Temperature Tstg..................................................................................................... -55~+150°C
Junction Temperature Tj .............................................................................................................. +150°C
• Maximum Voltages and Currents (Ta=25°C)
DC Reverse Voltage VR .................................................................................................................... 100 V
Peak Forward Current IF………………………………………………………………………… 225mA
Mean Rectifying Current IO ........................................................................................……….. 100mA
Peak Forward Surge Current IFSM………………………………….. ………………………………………. 500mA
• Thermal Characteristics
Total Device Dissipation @ TA=25°C (Note)
Thermal Resistance, Junction to Ambient
PD……………………………………………….150mW
RθJA……………………………………………833°C/W
Note: FR-5 board minimum pad.
Ordering Information
Device
1SS400Y2
Package
SOD-723
(Pb-free lead plating package)
Shipping
8000 pcs / Tape & Reel
Marking
7
1SS400Y2
CYStek Product Specification
1 page  
CYStech Electronics Corp.
SOD-723 Dimension
Spec. No. : C303Y2
Issued Date : 2011.05.16
Revised Date :
Page No. : 5/5
Marking Code :
1 72
12
Style : Pin 1. Cathode 2. Anode
2-lead SOD-723 Plastic Package
CYStek Package Code : Y2
*: Typical
DIM
Millimeters
Min. Max.
Inches
DIM Millimeters
Min. Max. Min. Min. Max.
Inches
Min. Max.
A 0.525 0.650 0.021 0.026 E 0.900 1.100 0.035 0.043
A1 0.515 0.580 0.020 0.023 E1 1.300 1.500 0.051 0.059
b 0.250 0.350 0.010 0.014 E2
0.200 REF
0.008 REF
c 0.080 0.150 0.003 0.006 L 0.010 0.070 0.001 0.003
D 0.550 0.650 0.022 0.026 θ
7° REF
7° REF
Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
2.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
1SS400Y2
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet 1SS400Y2.PDF ] | |
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