|
|
PDF TS14002 Data sheet ( Hoja de datos )
| Número de pieza | TS14002 | |
| Descripción | Ultra-Low-Power Linear Regulator | |
| Fabricantes | Semtech | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de TS14002 (archivo pdf) en la parte inferior de esta página. Total 13 Páginas | ||
|
No Preview Available !
TS14002
nanoSmart® Ultra-Low-Power
Linear Regulator
TRIUNE PRODUCTS
Features
• Ultra-low nA operating current at light load
• Best-in-class quiescent current of 20nA at Iload=0
• Best-in-class quiescent current of 100pA in disable mode
• Output voltage options of 1.2V - 4.2V in 100mV steps (pro-
grammed at manufacturing)
• Accurate output regulation
• Over-current protection
Summary Specifications
• Low input operating voltage of 2.5V to 5.5V
• Packaged in a 8pin DFN (2x2)
Description
The TS14002 linear regulator is an ultra-low-power circuit
which draws low nA level quiescent current at light load, but
has the capability to regulate current loads as high as 200mA.
Applications
• Portable electronics
• RFID
• Industrial
• Medical
• Energy harvesting systems
• SmartCard
Typical Applications
TS14002
VCC
CBYP
EN
GND
VOUT
FB
Load
COUT
TS14002
Final Datasheet
February 16, 2016
Rev 1.1
www.semtech.com
1 of 13
Semtech
1 page  
Typical Characteristics
Iqq Performance
Iqq Performance
Iqq Performance vs. Load Current
Iqq Performance vs. Load Current
Line Regulation Performance
VOUT Performance vs. Temperature
TS14002
Final Datasheet
February 16, 2016
Rev 1.1
www.semtech.com
5 of 13
Semtech
5 Page 
Mold compound
Die
Epoxy Die attach
Exposed pad
Solder
5% - 10% Cu coverage
Single Layer, 2oz Cu
Ground Layer, 1oz Cu
Thermal Vias with Cu plating
90% Cu coverage
Signal Layer, 1oz Cu
20% Cu coverage
Bottom Layer, 2oz Cu
Note: NOT to Scale
The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each
application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the
power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above
85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in
the application.
Application Using A Single Layer PCB
Use as much Copper Area
as possible for heat spread
Package Thermal Pad
Package Outline
Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board
application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method
(solder paste or thermal conductive epoxy).
In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat.
IMPORTANT:
If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation
capability will be adversely affected if the device is incorrectly mounted onto the circuit board.
TS14002
Final Datasheet
February 16, 2016
Rev 1.1
www.semtech.com
11 of 13
Semtech
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet TS14002.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| TS14002 | Ultra-Low-Power Linear Regulator | Semtech |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |