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PDF SSGM680200 Data sheet ( Hoja de datos )
| Número de pieza | SSGM680200 | |
| Descripción | 2 to 10 Circuits-designed Type | |
| Fabricantes | ALPS | |
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SSGM
2 to 10 Circuits-designed Type
Highly reliable IC-size type
with gold contact supports automatic insertion
■ Typical Specifications
Items
Rating（max.）（/ min.）
（Resistive load）
Contact resistance
（Initial performance / After lifetime）
Specifications
25mA 24V DC（At opening and closing）
0.1A 50V DC（When energized）/ 50μA 3V DC
50mΩmax. / 100mΩ max.
Operating force
3.5±2.5N
Operating life
Without load
With load
3,000 cycles
3,000 cycles（25mA 24V DC）
Product Line
Soldering
Actuator
configuration
Packaging style
Standard
Insertion
Stick
Flat
Standard
Reflow
Flat
Taping
Poles
2
3
4
5
6
7
8
9
10
4
6
8
10
4
8
2
4
6
8
Minimum order unit（pcs.）
Japan
Export
70 7,000
52 5,200
40 4,000
33 3,300
28 2,800
25 2,500
22 2,200
19 1,900
18 1,800
40 4,000
28 2,800
22 2,200
18 1,800
800
3,200
1,600
1,000
4,000
2,000
Product No.
SSGM120100
SSGM130100
SSGM140100
SSGM150100
SSGM160100
SSGM170100
SSGM180100
SSGM190100
SSGM1A0100
SSGM240100
SSGM260100
SSGM280100
SSGM2A0100
SSGM640200
SSGM680200
SSGM720101
SSGM740101
SSGM760102
SSGM780103
Drawing No.
1
2
3
4
180
Refer to P.183 for soldering conditions.
1 page  
Dual In-line Package Type Switches Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA（K）or CC（T）at soldering portion（copper foil surface）.
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
Room
temperature
Pre-heating
D max.
E max.
F
A max.
B
C
Time (s)
20 max.
Series（Reflow type）
SSGM
A（℃）
3s max.
250
B（℃）
240
C（℃）
150
D（s）
180
E（s）
----
F（s）
----
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated
conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Reference for Hand Soldering Condition
Soldering temperature
350±5℃
Soldering time
5s max.
Reference for Dip Soldering Condition
(For insertion terminal types)
Items
Preheating temperature
Preheating time
120℃ max.
90s max.
Dip soldering
Soldering temperature
Duration of immersion
270±5℃
10±1s max.
183
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