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What is IGC168T170S8RH?

This electronic component, produced by the manufacturer "Infineon", performs the same function as "IGBT3 Power Chip".


IGC168T170S8RH Datasheet PDF - Infineon

Part Number IGC168T170S8RH
Description IGBT3 Power Chip
Manufacturers Infineon 
Logo Infineon Logo 


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IGC168T170S8RH
IGBT3 Power Chip
Features:
1700V Trench + Field stop technology
low switching losses and saturation losses
soft turn off
positive temperature coefficient
easy paralleling
This chip is used for:
power modules
Applications:
drives
Chip Type
VCE
IC
Die Size
IGC168T170S8RH 1700V 150A 13.38 x 12.58 mm2
C
G
E
Package
sawn on foil
Mechanical Parameters
Raster size
Emitter pad size (incl. gate pad)
Gate pad size
Area total
Thickness
Wafer size
Max.possible chips per wafer
Passivation frontside
Pad metal
Backside metal
13.38 x 12.58
11.159 x 10.353
1.674 x 0.899
mm2
168.3
190 µm
200 mm
142
Photoimide
3200 nm AlSiCu
Ni Ag system
suitable for epoxy and soft solder die bonding
Die bond
Electrically conductive glue or solder
Wire bond
Reject ink dot size
for original and
sealed MBB bags
Storage environment
for open MBB bags
Al, <500µm
0.65mm ; max 1.2mm
Ambient atmosphere air, Temperature 17°C 25°C,
< 6 month
Acc. to IEC62258-3: Atmosphere >99% Nitrogen or inert gas,
Humidity <25%RH, Temperature 17°C 25°C, < 6 month
Edited by INFINEON Technologies, IFAG IPC TD VLS, L7793N, L7793U, L7793F, Rev 0.9, 27.06.2014

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IGC168T170S8RH equivalent
IGC168T170S8RH
Description
AQL 0,65 for visual inspection according to failure catalogue
Electrostatic Discharge Sensitive Device according to MIL-STD 883
Revision History
Version
Subjects (major changes since last revision)
Date
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2014 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or
any information regarding the application of the device, Infineon Technologies hereby disclaims any and all
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the
types in question, please contact the nearest Infineon Technologies Office.
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or
systems and/or automotive, aviation and aerospace applications or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the
failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be implanted in the
human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable
to assume that the health of the user or other persons may be endangered.
Edited by INFINEON Technologies, IFAG IPC TD VLS, L7793N, L7793U, L7793F, Rev 0.9, 27.06.2014


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