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PDF HSMP-386J Data sheet ( Hoja de datos )
| Número de pieza | HSMP-386J | |
| Descripción | High Power RF PIN Diode | |
| Fabricantes | AVAGO | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HSMP-386J (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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HSMP-386J
High Power RF PIN Diode
Data Sheet
Description
Avago Technologies' HSMP-386J is a High Power RF PIN
Diode specifically design for high power handling and low
distortion Transmit/Receive switching application. It is
housed in QFN 2x2mm size package which is having good
thermal resistance.
The unique with 8 dies in parallel configuration results to
low IL performance and low series resistance. The HSMP-
386J Power diode is built with match diode to ensure con-
sistency in performance.
Package Marking & Orientation
Pin#1
Not Used
Anode
Pin#1
Cathode
Top view
Bottom view
Notes:
6P = Device Code
x = Month code indicates the month of manufacture
Features
• High Power Surface Mount Package QFN 2x2
• Match Diode for Consistent Performance
• Low Bias Current Requirement
• Low Series Resistance
• Low Insertion Loss & High Isolation
• Better Thermal Conductivity for Higher Power Dissipation
• Low Failure in Time (FIT) Rate
• Lead-free Option Available
• MSL1 & Lead Free
• Tape & Reel Option Available
Specifications
• Low RS Switching typically 0.65Ω @ 100MHz., 50mA
• High Power Handling Up to 10W (40dBm) at 2GHz,
50mA
Application
• High Power Transmit / Receive Switch for Cellular
Infrastructure and Two Way Radio
Circuit Diagram of HSMP-386J
Pin #1
Cathode
Anode
Connected externally
on PCB board
1 page  
PCB Land Pattern and Stencil Design
0.88
1.00
0.80
0.88
0.80
1.00
PCB Land Pattern A (top view)
0.95
0.83 0.75
0.00
0.83
0.75
0.95
Stencil Layout A (top view)
PIN 1
∅ 0.20 (7.87)
Solder
mask
2.80 (110.24)
0.70 (27.56)
0.25 (9.84)
0.25 (9.84)
0.50 (19.68)
1.60 (62.99)
+ 0.28 (10.83)
PIN 1
2.72 (107.09)
0.63 (24.80)
0.22 (8.86)
0.32 (12.79)
0.50 (19.68)
1.54 (60.61)
0.25 (9.74)
RF transmission
line
0.80 (31.50)
0.15 (5.91)
0.55 (21.65)
0.60 (23.62)
PCB Land Pattern B (top view)
0.72 (28.35)
0.63 (24.80)
Stencil Layout B (top view)
Note :
1. All dimensions in millimeters (mils).
2. For PCB land pattern B and stencil layout B, external trace is required to connect all cathode pads as one single pad.
Ordering Information
Part Number
HSMP-386J-TR1G
HSMP-386J-TR2G
HSMP-386J-BLKG
No. of Devices
3000
10000
100
Container
7” Reel
13” Reel
antistatic bag
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet HSMP-386J.PDF ] | |
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