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KLMAG2WEPD-B031 PDF Datasheet - Samsung

Part Number KLMAG2WEPD-B031
Description eMMC
Manufacturers Samsung 
Logo Samsung Logo 
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KLMAG2WEPD-B031 datasheet, circuit
SAMSUNG CONFIDENTIAL
Rev. 1.0 Aug. 2014
KLMxGxxEPD-B031
Samsung e·MMC Product family
e.MMC 5.0 Specification compatibility
SAMSUNG
datasheetgl@techtronics.com.cn
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2014 Samsung Electronics Co., Ltd. All rights reserved.
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1 page
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KLMAG2WEPD-B031 pdf, schematic
KLMxGxxEPD-B031
Revision History
Revision No.
0.5 1.Engineering Sample
1.0 1. Customer Sample
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.0
e·MMC
History
Draft Date Remark
Jul. 08, 2014 Preliminary
Aug.04, 2014
Final
Editor
S.M.Lee
S.M.Lee
SAMSUNG
gl@techtronics.com.cn
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
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2 Page
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KLMAG2WEPD-B031 equivalent
KLMxGxxEPD-B031
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.0
e·MMC
3.0 PACKAGE CONFIGURATIONS
3.1 153 Ball Pin Configuration
[Table 2] 153 Ball Information
Pin NO
A3
Name
DAT0
A4 DAT1
Ball-side down view
A5 DAT2
NC
B2 DAT3
DNU DNU DNU DNU
DNU
DNU
DNU
B3 DAT4
B4 DAT5
B5 DAT6
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
B6 DAT7
DNU DNU
DNU
K5 RSTN
C6 VDD
1 2 3 4 5 6 7 8 9 10 11 12 13 14
A DAT0 DAT1 DAT2 Vss RFU
M4 VDD
B DAT3 DAT4 DAT5 DAT6 DAT7
N4 VDD
C VDDI Vss VDD
P3 VDD
P5 VDD
E6 VDDF
F5 VDDF
D
E RFU VDDF Vss RFU RFU RFU
F VDDF
RFU
J10 VDDF
G RFU Vss
RFU
K9 VDDF
C2 VDDI
SAMSUNGM5 CMD
H SDtraotbae
Vss
J Vss VDDF
K RSTN RFU RFU Vss VDDF RFU
H5 Data Strobe
L
M6 CLK
J5 VSS
A6 VSS
C4 VSS
gl@teMchtronVDDicCMDsC.LcK om.cn
N Vss VDD Vss
P VDD Vss VDD Vss RFU
RFU
E7 VSS
G5 VSS
H10 VSS
K8 VSS
N2 VSS
N5 VSS
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU DNU
DNU
DNU DNU
DNU
DNU
DNU DNU
DNU
DNU
P4 VSS
P6 VSS
Figure 1. 153-FBGA
CLK : Clock input
Data Strobe : Newly assigned pin for HS400 mode. Data Strobe is generated from e.MMC to host.
In HS400 mode, read data and CRC response are synchronized with Data Strobe.
CMD : A bidirectional signal used for device initialization and command transfers.
Command operates in two modes, open-drain for initialization and push-pull for fast command transfer.
DAT0-7 : Bidirectional data channels. It operates in push-pull mode.
RST_n : H/W reset signal pin
VDDF(VCC) : Supply voltage for flash memory
VDD(VCCQ) : Supply voltage for memory controller
VDDi : Internal power node to stabilize regulator output to controller core logics
VSS : Ground connections
RFU : Reserved for future use , do not use for any usage
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
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5 Page
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KLMAG2WEPD-B031 diode, scr
KLMxGxxEPD-B031
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.0
e·MMC
[Table 6] High speed timing values (EXT_CSD register : HS_TIMING [185])
Value
Timing Interface
0x0 Selecting backwards compatibility interface timing
0x1 High Speed
0x2 HS200
0x3 HS400
Supportability
Support
Support
Support
Support
NOTE:
1) It is being discussed in JEDEC and is not confirmed yet. It can be modified according to JEDEC standard in the future.
SAMSUNG
gl@techtronics.com.cn
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
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9 Page
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KLMAG2WEPD-B031 transistor, igbt
KLMxGxxEPD-B031
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.0
e·MMC
7.3.2 HS400 Device Output Timing
Data Strobe is used to read data (data read and CRC status response read) in HS400 mode. The device output value of Data Strobe is “High-Z” when the
device is not in outputting data(data read, CRC status response). Data Strobe is toggled only during data read period.
Figure 7. HS400 Device Output Timing
NOTE:
VOH denotes VOH(min.) and VOL denotes VOL(max.).
[Table 23] HS400 Device Output timing
SAMSUNGParameter
Symbol Min Max
Data Strobe
Cycle time data transfer mode
Slew rate
tPERIODgl@techtro5nics.com.cn
SR 1.125
Duty cycle distortion
tDSDCD
0.0
0.2
Minimum pulse width
tDSMPW
2.0
Read pre-amble
tRPRE
0.4 -
Read post-amble
tRPST
0.4 -
Output DAT (referenced to Data Strobe)
Output skew
tRQ
0.4
Output hold skew
tRQH
0.4
Slew rate
SR 1.125
NOTE :
1) It is being discussed in JEDEC and is not confirmed yet. It can be modified according to JEDEC standard in the future.
Unit
V/ns
ns
ns
tPERIOD
tPERIOD
ns
ns
V/ns
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
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