NVMFS5C410N Datasheet PDF - ON Semiconductor
Part Number | NVMFS5C410N | |
Description | Power MOSFET ( Transistor ) | |
Manufacturers | ON Semiconductor | |
Logo | ||
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Power MOSFET
40 V, 0.92 mW, 300 A, Single N−Channel
Features
• Small Footprint (5x6 mm) for Compact Design
• Low RDS(on) to Minimize Conduction Losses
• Low QG and Capacitance to Minimize Driver Losses
• NVMFS5C410NWF − Wettable Flank Option for Enhanced Optical
Inspection
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current RqJC
(Notes 1, 3)
Power Dissipation
RqJC (Note 1)
Continuous Drain
Current RqJA
(Notes 1, 2, 3)
Power Dissipation
RqJA (Notes 1 & 2)
Pulsed Drain Current
TC = 25°C
Steady
State
TC = 100°C
TC = 25°C
TC = 100°C
TA = 25°C
Steady
State
TA = 100°C
TA = 25°C
TA = 100°C
TA = 25°C, tp = 10 ms
Operating Junction and Storage Temperature
VDSS
VGS
ID
PD
ID
PD
IDM
TJ, Tstg
40
±20
300
212
166
83
46
32
3.9
1.9
900
−55 to
+ 175
V
V
A
W
A
W
A
°C
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (IL(pk) = 34 A)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
IS 158 A
EAS 578 mJ
TL 260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
Junction−to−Case − Steady State
RqJC
0.9 °C/W
Junction−to−Ambient − Steady State (Note 2) RqJA
39
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm2, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
www.onsemi.com
V(BR)DSS
40 V
RDS(ON) MAX
0.92 mW @ 10 V
ID MAX
300 A
D (5,6)
G (4)
S (1,2,3)
N−CHANNEL MOSFET
1
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
MARKING
DIAGRAM
D
S
S XXXXXX
S AYWZZ
G
D
D
D
XXXXXX = 5C410N
XXXXXX = (NVMFS5C410N) or
XXXXXX = 410NWF
XXXXXX = (NVMFS5C410NWF)
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
August, 2015 − Rev. 0
1
Publication Order Number:
NVMFS5C410N/D
|
|
NVMFS5C410N
100
50% Duty Cycle
10 20%
10%
5%
1 2%
1%
NVMFS5C410N 650 mm2, 2 oz., Cu Single Layer Pad
0.1
0.01
0.000001 0.00001
Single Pulse
0.0001
0.001
0.01
0.1
PULSE TIME (sec)
Figure 13. Thermal Characteristics
1
10 100 1000
DEVICE ORDERING INFORMATION
Device
NVMFS5C410NT1G
Marking
5C410N
Package
DFN5
(Pb−Free)
Shipping†
1500 / Tape & Reel
NVMFS5C410NWFT1G
410NWF
DFN5
(Pb−Free, Wettable Flanks)
1500 / Tape & Reel
NVMFS5C410NT3G
5C410N
DFN5
(Pb−Free)
5000 / Tape & Reel
NVMFS5C410NWFT3G
410NWF
DFN5
(Pb−Free, Wettable Flanks)
5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
5
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