NTMFS5C430NL Datasheet PDF - ON Semiconductor
Part Number | NTMFS5C430NL | |
Description | Power MOSFET ( Transistor ) | |
Manufacturers | ON Semiconductor | |
Logo | ||
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Power MOSFET
40 V, 1.5 mW, 200 A, Single N−Channel
Features
• Small Footprint (5x6 mm) for Compact Design
• Low RDS(on) to Minimize Conduction Losses
• Low QG and Capacitance to Minimize Driver Losses
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value
Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
C(Nuortreesnt1R, 3qJ)C
Power Dissipation
RqJC (Note 1)
Steady
State
TC = 25°C
TC = 100°C
TC = 25°C
TC = 100°C
Continuous Drain
C(Nuortreesnt1R, 2qJ,A3)
Power Dissipation
RqJA (Notes 1 & 2)
Steady
State
TA = 25°C
TA = 100°C
TA = 25°C
TA = 100°C
Pulsed Drain Current TA = 25°C, tp = 10 ms
Operating Junction and Storage Temperature
VDSS
VGS
ID
PD
ID
PD
IDM
TJ, Tstg
40
±20
200
140
110
53
37
26
3.8
1.9
900
−55 to
+175
V
V
A
W
A
W
A
°C
Source Current (Body Diode)
IS 120 A
Single Pulse Drain−to−Source Avalanche
Energy (IL(pk) = 15 A)
EAS 493 mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL 260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
Junction−to−Case − Steady State
RqJC
1.4 °C/W
Junction−to−Ambient − Steady State (Note 2)
RqJA
40
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm2, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
www.onsemi.com
V(BR)DSS
40 V
RDS(ON) MAX
1.5 mW @ 10 V
2.2 mW @ 4.5 V
ID MAX
200 A
D (5)
G (4)
S (1,2,3)
N−CHANNEL MOSFET
1
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
MARKING
DIAGRAM
D
S
S 5C430L
S AYWZZ
G
D
D
D
5C430L = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. 0
1
Publication Order Number:
NTMFS5C430NL/D
|
|
100
50% Duty Cycle
10 20%
10%
5%
1 2%
1%
0.1
0.01
0.000001
Single Pulse
0.00001
0.0001
NTMFS5C430NL
TYPICAL CHARACTERISTICS
0.001
0.01
0.1
PULSE TIME (sec)
Figure 13. Thermal Characteristics
1
10 100 1000
DEVICE ORDERING INFORMATION
Device
NTMFS5C430NLT1G
Marking
5C430L
Package
DFN5
(Pb−Free)
Shipping†
1500 / Tape & Reel
NTMFS5C430NLT3G
5C430L
DFN5
(Pb−Free)
5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
5
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