MBRF40200CT Datasheet PDF - SANGDEST MICROELECTRONICS
| Part Number | MBRF40200CT | |
| Description | Schottky Rectifier ( Diode ) | |
| Manufacturers | SANGDEST MICROELECTRONICS | |
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SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N0858, Rev. A
MBRF40200CT
Green Products
MBRF40200CT SCHOTTKY RECTIFIER
Applications:
• Switching power supply
• Converters
• Free-Wheeling diodes
• Reverse battery protection
Features:
• 150 °C T J operation
• Center tap configuration
• Low forward voltage drop
• High purity, high temperature epoxy encapsulation for enhanced
mechanical strength and moisture resistance
• High frequency operation
• Guard ring for enhanced ruggedness and long term reliability
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request
Mechanical Dimensions: In mm
OUTLINE DRAWING
OPTION 1(CJ) OPTION 2(HD)
Dim Min Max Min
Max
A
4.4 4.6 4.30
4.70
b
0.6TYP
0.50
0.75
b1
1.3TYP
1.30
1.40
b2
1.7TYP
1.70
1.80
b3
1.6TYP
1.50
1.75
b4
1.2TYP
1.10
1.35
C
0.60TYP
0.50
0.75
D 14.8 15.1 14.80 15.20
E 10.06 10.26 9.96 10.36
e 2.55TYP
2.54TYP
F
2.9 3.1 2.80
3.20
G
6.5 6.9 6.50
6.90
L 12.7 13.7 12.8 13.2
L1 3.4 3.8 3.60 4.00
L2 2.6 3.0
-
-
Q
2.5 2.9 2.50
2.90
Q1 2.5 2.9
2.70REF
ØR 3.5REF
3.50REF
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 •
• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •
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SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N0858, Rev. A
Electrical Characteristics:
Characteristics
Max. Forward Voltage Drop
(per leg)*
Max. Reverse Current (per
leg)*
Max. Junction Capacitance
(per leg)
Typical Series Inductance
(per leg)
Max. Voltage Rate of Change
RSM Isolation Voltage
(t = 1.0 second, R. H. < =30%,
TA = 25 °C)
* Pulse Width < 300µs, Duty Cycle <2%
Symbol
VF1
VF2
IR1
IR2
CT
LS
dv/dt
VISO
Condition
@ 20A, Pulse, TJ = 25 °C
@ 20A, Pulse, TJ = 125 °C
@VR = rated VR
TJ = 25 °C
@VR = rated VR
TJ = 125 °C
@VR = 5V, TC = 25 °C
fSIG = 1MHz
Measured lead to lead 5 mm from
package body
-
Clip mounting, the epoxy body
away from the heatsink edge by
more than 0.110" along the lead
direction.
Clip mounting, the epoxy body is
inside the heatsink.
Screw mounting, the epoxy body
is inside the heatsink.
MBRF40200CT
Green Products
Max.
0.95
0.85
1.0
11
450
8.0
10,000
4500
3500
1500
Units
V
V
mA
mA
pF
nH
V/µs
V
Thermal-Mechanical Specifications:
Characteristics
Max. Junction Temperature
Max. Storage Temperature
Maximum Thermal
Resistance Junction to Case
(per leg)
Approximate Weight
Case Style
Symbol
TJ
Tstg
Condition
-
-
RθJC DC operation
wt -
ITO-220AB
Specification
-55 to +150
-55 to +150
Units
°C
°C
2.0 °C/W
2g
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 •
• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •
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Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for MBRF40200CT electronic component. |
| Information | Total 7 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ MBRF40200CT.PDF Datasheet ] | |
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