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PDF SK550SC Data sheet ( Hoja de datos )
| Número de pieza | SK550SC | |
| Descripción | Surface Mount Schottky Barrier Diodes | |
| Fabricantes | CYStech | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de SK550SC (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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CYStech Electronics Corp.
Spec. No. : C337SC
Issued Date : 2011.03.10
Revised Date : 2013.05.22
Page No. : 1/6
5.0Amp. Surface Mount Schottky Barrier Diodes
SK520SC thru SK5100SC
Features
• For surface mounted applications.
• For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
• Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
• Low leakage current
• High surge capability
• High temperature soldering: 250°C/10 seconds at terminals
• Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
• Case: Molded plastic, SMC/JEDEC DO-214AB.
• Terminals: Solder plated, solderable per MIL-STD-750 method 2026
• Polarity: Indicated by cathode band.
• Mounting Position : Any.
• Weight: 0.195 gram, 0.00585 ounce
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified. )
Parameter
Symbol
SK520 SK530
SK540
Type
SK550
SK560
SK580 SK5100 Units
Repetitive peak reverse voltage
VRRM 20
30
40
50
60
80 100 V
Maximum RMS voltage
VRMS 14
21
28
35
42
56
70
V
Maximum DC blocking voltage
VR 20 30 40 50 60 80 100 V
Maximum instantaneous
forward voltage, IF=5A (Note 1)
VF 0.55 0.55 0.55 0.7 0.7 0.85 0.85 V
Average forward rectified current
IO
5A
Peak forward surge current @8.3ms
single half sine wave superimposed IFSM 150 A
on rated load (JEDEC method)
Maximum DC reverse current
VR=VRRM,TA=25℃
VR=VRRM,TA=125℃
IR
0.5
50
mA
mA
Maximum thermal resistance,
Junction to ambient
Rth,JA
46 ℃/W
Maximum thermal resistance,
Junction to case
Rth,JC
24 ℃/W
Diode junction capacitance @
f=1MHz and applied 4VDC reverse CJ
380(typ)
pF
voltage
Storage temperature
Tstg
-55 ~ +150
℃
Operating temperature
TJ -55 ~ +125
-55 ~ +150
℃
SK520SC-SK5100SC
CYStek Product Specification
1 page  
CYStech Electronics Corp.
Recommended temperature profile for IR reflow
Spec. No. : C337SC
Issued Date : 2011.03.10
Revised Date : 2013.05.22
Page No. : 5/6
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
3°C/second max.
Pb-free Assembly
3°C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak
temperature
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5 °C
10-30 seconds
6°C/second max.
6 minutes max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260 +0/-5 °C
20-40 seconds
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK520SC-SK5100SC
CYStek Product Specification
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet SK550SC.PDF ] | |
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