NCV7513B Datasheet PDF - ON Semiconductor
| Part Number | NCV7513B | |
| Description | Hex Low-Side MOSFET Pre-Driver | |
| Manufacturers | ON Semiconductor | |
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NCV7513B
FLEXMOSt Hex Low-Side
MOSFET Pre-Driver
The NCV7513B programmable six channel low−side MOSFET
pre−driver is one of a family of FLEXMOSTM automotive grade
products for driving logic−level MOSFETs. The product is
controllable by a combination of serial SPI and parallel inputs. It
features programmable fault management modes and allows
power−limiting PWM operation with programmable refresh time.
The device offers 3.3 V/5.0 V compatible inputs and the serial output
driver can be powered from either 3.3 V or 5.0 V. Power−on reset
provides controlled powerup and two enable inputs allow all outputs
to be simultaneously disabled.
Each channel independently monitors its external MOSFET’s
drain voltage for fault conditions. Shorted load fault detection
thresholds are fully programmable using an externally programmed
reference voltage and a combination of four discrete internal ratio
values. The ratio values are SPI selectable and allow different
detection thresholds for each group of three output channels.
Fault information for each channel is 2−bit encoded by fault type
and is available through SPI communication. Fault recovery
operation for each channel is programmable and may be selected for
latch−off or automatic retry.
The FLEXMOS family of products offers application scalability
through choice of external MOSFETs.
Features
• 16−Bit SPI with Frame Error Detection
• 3.3 V/5.0 V Compatible Parallel and Serial Control Inputs
• 3.3 V/5.0 V Compatible Serial Output Driver
• Two Enable Inputs
• Open−Drain Fault and Status Flags
• Programmable
− Shorted Load Fault Detection Thresholds
− Fault Recovery Mode
− Fault Retry Timer
− Flag Masking
• Load Diagnostics with Latched Unique Fault Type Data
− Shorted Load
− Open Load
− Short to GND
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Benefits
• Scalable to Load by Choice of External MOSFET
www.onsemi.com
MARKING
DIAGRAM
LQFP32
FT SUFFIX
CASE 561AB
NCV7513B
AWLYYWWG
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb−Free Package
ORDERING INFORMATION
Device
NCV7513BFTG
Package
LQFP
(Pb−Free)
Shipping†
250 Units/Tray
NCV7513BFTR2G LQFP 2000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 2
1
Publication Order Number:
NCV7513B/D
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NCV7513B
MAXIMUM RATINGS (Voltages are with respect to device substrate.)
Rating
Value
Unit
DC Supply (VCC1, VCC2, VDD)
Difference Between VCC1 and VCC2
Difference Between GND (Substrate) and VSS
Output Voltage (Any Output)
−0.3 to 6.5
"0.3
"0.3
−0.3 to 6.5
V
V
V
V
Drain Feedback Clamp Voltage (Note 1)
−0.3 to 47
V
Drain Feedback Clamp Current (Note 1)
10 mA
Input Voltage (Any Input)
−0.3 to 6.5
V
Junction Temperature, TJ
Storage Temperature, TSTG
Peak Reflow Soldering Temperature: Lead−Free
60 to 150 seconds at 217°C (Note 2)
−40 to 150
−65 to 150
260 peak
°C
°C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
ATTRIBUTES
Characteristic
Value
ESD Capability
Human Body Model
Machine Model
w " 2.0 kV
w " 200 V
Moisture Sensitivity (Note 2)
MSL2
Package Thermal Resistance (Note 3)
Junction–to–Ambient, RqJA
Junction–to–Pin, RYJL
86.0 °C/W
58.5 °C/W
1. An external series resistor must be connected between the MOSFET drain and the feedback input in the application. Total clamp power
dissipation is limited by the maximum junction temperature, the application environment temperature, and the package thermal resistances.
2. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D, and
Application Note AND8003/D.
3. Values represent still air steady−state thermal performance on a 4 layer (42 x 42 x 1.5 mm) PCB with 1 oz. copper on an FR4 substrate, using
a minimum width signal trace pattern (384 mm2 trace area).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min Max Unit
VCC1
Main Power Supply Voltage
4.75 5.25 V
VCC2
Gate Drivers Power Supply Voltage
VCC1 − 0.3
VCC1 + 0.3
V
VDD Serial Output Driver Power Supply Voltage
3.0
VCC1
V
VIN High
Logic High Input Voltage
2.0
VCC1
V
VIN Low
Logic Low Input Voltage
0 0.8 V
TA Ambient Still−Air Operating Temperature
−40 125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the
Recommended Operating Ranges limits may affect device reliability.
www.onsemi.com
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| Information | Total 24 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ NCV7513B.PDF Datasheet ] | |
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| Part Number | Description | MFRS |
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