|
|
PDF MPX5050 Data sheet ( Hoja de datos )
| Número de pieza | MPX5050 | |
| Descripción | Integrated Silicon Pressure Sensor | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de MPX5050 (archivo pdf) en la parte inferior de esta página. Total 18 Páginas | ||
|
No Preview Available !
Freescale Semiconductor
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXx5050 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated Over -40° to +125°C
• Patented Silicon Shear Stress Strain Gauge
• Durable Epoxy Unibody Element
• Easy-to-Use Chip Carrier Option
Pressure
MPX5050
Rev 10, 10/2009
MPX5050
MPXV5050
MPVZ5050
Series
0 to 50 kPa (0 to 7.25 psi)
0.2 to 4.7 V Output
ORDERING INFORMATION
Device Name
Case
No.
Unibody Package (MPX5050 Series)
None
# of Ports
Single
Dual
Gauge
MPX5050D
867 •
MPX5050DP
867C
MPX5050GP
867B
MPX5050GP1
867B
Small Outline Package (MPXV5050 Series)
•
•
•
•
•
MPXV5050GP
1369
•
MPXV5050DP
1351
•
MPXV5050GC6U
482A
•
MPXV5050GC6T1
482A
•
Small Outline Package (Media Resistant Gel) (MPVZ5050 Series)
•
•
•
MPVZ5050GW7U
1560
•
•
Pressure Type
Differential Absolute
•
•
•
Device
Marking
MPX5050D
MPX5050DP
MPX5050GP
MPX5050GP
MPXV5050GP
MPXV5050DP
MPXV5050G
MPXV5050G
MZ5050GW
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
1 page  
On-chip Temperature Compensation and Calibration
Pressure
Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5050/MPXV5050G series pressure sensor
operating characteristics, and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
sensor performance and long-term reliability. Contact the
factory for information regarding media compatibility in your
application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0× to 85×C using the decoupling circuit shown in Figure 4.
The output will saturate outside of the specified pressure
range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
5.0
4.5
Transfer Function:
Vout = VS*(0.018*P+0.04) ± ERROR
4.0 VS = 5.0 Vdc
3.5 TEMP = 0 to 85°C
3.0
2.5
MAX
2.0
1.5
1.0
0.5
MIN
0 0 5 10 15 20 25 30 35 40
Differential Pressure (kPa)
TYPICAL
45 50
55
Figure 2. Output vs. Pressure Differential
Fluorosilicone
Gel Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Epoxy
Plastic
Case
Lead Frame
Differential/Gauge Element
P2
Die
Bond
Figure 3. Cross-Sectional Diagram (not to scale)
+5 V
1.0 μF
Vout
Vs
IPS
0.01 μF
GND
OUTPUT
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
Sensors
Freescale Semiconductor
MPX5050
5
5 Page 
PACKAGE DIMENSIONS
Pressure
Sensors
Freescale Semiconductor
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
PAGE 1 OF 2
MPX5050
11
11 Page | ||
| Páginas | Total 18 Páginas | |
| PDF Descargar | [ Datasheet MPX5050.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| MPX5050 | OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR |  Motorola Semiconductors |
| MPX5050 | Integrated Silicon Pressure Sensor | Freescale Semiconductor |
| MPX5050D | Integrated Silicon Pressure Sensor | Freescale Semiconductor |
| MPX5050DP | Integrated Silicon Pressure Sensor | Freescale Semiconductor |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |