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PDF RT9032 Data sheet ( Hoja de datos )

Número de pieza RT9032
Descripción Programmable Dual Output Linear Regulator
Fabricantes Richtek 
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®
RT9032
Programmable Dual Output Linear Regulator
General Description
Features
The RT9032 is a dual channels, low noise and low dropout
Wide Operating Voltage Ranges : 2.5V to 5.5V
voltage regulator souring up to 300mA at each channel.
Dual LDO Output
The output voltage range is from 1.1V to 3.3V by operating
Pin Programmable Output Voltage
voltage range from 2.5V to 5.5V.
Low-Noise for RF Application
The output voltages of the RT9032 can be programmed by
setting the voltage of P1 and P2. There are 9 different
voltage settings in one chip. User can choose output
voltages easily by setting P1, P2 to VDD, GND or floating.
The RT9032 offers 3% accuracy, low dropout (330mV
@300mA) and extremely low ground current, only 32μA
per LDO. The shutdown current is near to zero current
which is suitable for battery-powered device. Other
features include current limiting, over temperature
protection and output short circuit protection.
No Noise Bypass Capacitor Required
Fast Response in Line/Load Transient
Low Quiescent Current of 32μA/LDO
3% High Output Accuracy
Current Limiting Protection
Thermal Shutdown Protection
Short Circuit Protection
Tiny WDFN-8L 2x2 and WQFN-8L 1.6x1.6 (COL)
Packages
RoHS Compliant and Halogen Free
The RT9032 can operate stable with very small ceramic
output capacitors, reducing required board space and
Applications
Mobile Phone
component cost. The RT9032 is available in WDFN-8L
Smart Hand-Held Devices
2x2 and WQFN-8L 1.6x1.6 (COL) packages.
Digital Still Camera
Battery-Powered Equipments
Ordering Information
PCMCIA Cards
RT9032
Package Type
QW : WDFN-8L 2x2 (W-Type)
QWA : WQFN-8L 1.6x1.6 (COL) (W-Type)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Pin Configurations
(TOP VIEW)
VIN 1
EN1 2
P2 3
P1 4
8 VOUT1
7 VOUT2
6 GND
9 5 EN2
Note :
Output Voltage
A : Combination A
B : Combination B
C : Combination C
D : Combination D
J : Combination J
Richtek products are :
` RoHS compliant and compatible with the current require-
WDFN-8L 2x2
VOUT1
8
VIN 1
7 VOUT2
EN1 2
6 P2
EN2 3
5 GND
4
P1
WQFN-8L 1.6x1.6 (COL)
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area.
Copyright ©2012 Richtek Technology Corporation. All rights reserved.
DS9032-03 August 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
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RT9032 pdf
RT9032
Absolute Maximum Ratings (Note 1)
Supply Input Voltage (VIN) ---------------------------------------------------------------------------------------------- 6.5V
I/O Pin Voltage (EN1, EN2, P1, P2, VOUT1, VOUT2) ----------------------------------------------------------- 6.5V
Power Dissipation, PD @ TA = 25°C
WDFN-8L 2x2 -------------------------------------------------------------------------------------------------------------- 0.606W
WQFN-8L 1.6x1.6 (COL) ------------------------------------------------------------------------------------------------ 0.571W
Package Thermal Resistance (Note 2)
WDFN-8L 2x2, θJA --------------------------------------------------------------------------------------------------------- 165°C/W
WDFN-8L 2x2, θJC --------------------------------------------------------------------------------------------------------- 20°C/W
WQFN-8L 1.6x1.6 (COL), θJA ------------------------------------------------------------------------------------------- 175°C/W
Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260°C
Junction Temperature ----------------------------------------------------------------------------------------------------- 150°C
Storage Temperature Range -------------------------------------------------------------------------------------------- 65°C to 150°C
ESD Susceptibility (Note 3)
HBM (Human Body Model) ---------------------------------------------------------------------------------------------- 2kV
MM (Machine Model) ----------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions (Note 4)
Supply Input Voltage ------------------------------------------------------------------------------------------------------ 2.5V to 5.5V
Junction Temperature Range -------------------------------------------------------------------------------------------- 40°C to 125°C
Ambient Temperature Range -------------------------------------------------------------------------------------------- 40°C to 85°C
Electrical Characteristics
(VIN = VOUTX + 0.7V, VENX = VIN, CIN = COUT1 = COUT2 =1μF, TA = 25°C unless otherwise specified.)
Parameter
Symbol
Test Conditions
Quiescent Current (Note5) IQ
VEN > 1.5V,
Shutdown Current
I SHDN
VEN < 0.4V
Min Typ
-- 65
-- --
Output (VOUT1, VOUT2)
Output Voltage Range
Dropout Voltage (Note 6)
Output Accuracy
Line Regulation
Load Regulation
VOUT
VDROP
ΔV
ΔVLINE
ΔVLOAD
Power Supply Rejection Rate PSRR
IOUT = 300mA
IOUT = 1mA
VIN = 2.5V to 5.5V
1mA < IOUT < 300mA
f = 100Hz, ILOAD = 10mA
f = 1kHz, ILOAD = 10mA
f = 10kHz, ILOAD = 10mA
f = 100Hz, ILOAD = 150mA
f = 1kHz, ILOAD = 150mA
f = 10kHz, ILOAD = 150mA
1.1 --
-- 330
3 --
-- --
-- --
-- 65
-- 60
-- 50
-- 65
-- 50
-- 50
Max
80
1
3.3
500
+3
0.2
0.6
--
--
--
--
--
--
Unit
μA
μA
V
mV
%
%/V
%
dB
dB
Copyright ©2012 Richtek Technology Corporation. All rights reserved.
DS9032-03 August 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
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RT9032 arduino
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
PD(MAX) = (TJ(MAX) TA) /θJA
Where TJ(MAX) is the maximum operation junction
temperature, TA is the ambient temperature and the θJA is
the junction to ambient thermal resistance.
For recommended operating conditions specification, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance (θJA is layout dependent) for
WDFN-8L 2x2 is 165°C/W and WQFN-8L 1.6x1.6 (COL)
is 175°C/W on the standard JEDEC 51-3 single-layer
thermal test board. The maximum power dissipation at TA
= 25°C can be calculated by following formula :
PD(MAX) = (125°C 25°C) / (165°C/W) = 0.606W for
WDFN-8L 2x2 packages
PD(MAX) = (125°C 25°C) / (175°C/W) = 0.571W for
WQFN-8L 1.6x1.6 (COL) packages
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance θJA. The Figure 2 of derating curves allows the
designer to see the effect of rising ambient temperature
on the maximum power allowed.
0.7
WDFN-8L 2x2
0.6
Single Layer PCB
0.5
0.4 WQFN-8L 1.6x1.6
0.3
0.2
0.1
0
0 15 30 45 60 75 90 105 120 135
Ambient Temperature (°C)
Figure 2. Derating Curve of Maximum Power Dissipation
RT9032
Layout Considerations
Careful PCB Layout is necessary for better performance.
The following guidelines should be followed for good PCB
layout.
` Place the input and output capacitors as close as possible
to the IC.
` Keep VIN, VOUT1 and VOUT2 traces as possible as
short and wide.
` Connect GND pin and Exposed Pad to a large PCB
ground plane for maximum thermal dissipation.
CIN should be placed as
close as possible to VIN
pin for good filtering.
COUT1 & COUT2 should
be placed as close as
possible to VOUT pin for
good filtering.
CIN
VIN 1
EN1 2
P2 3
P1 4
8 VOUT1
7 VOUT2
6 GND
9 5 EN2
COUT1
COUT2
The exposed pad should be
connected to a strong ground
plane for heat sinking and
noise reduction.
Figure 3. Layout Considerations for WDFN-8L 2x2
Packages
CIN should be placed as
close as possible to VIN
pin for good filtering.
COUT1
COUT1 & COUT2 should
be placed as close as
possible to output pin for
good filtering.
CIN
VOUT1
8
VIN 1
7 VOUT2
EN1 2
EN2 3
6 P2
5 GND
COUT2
4
P1 GND
Figure 4. Layout Considerations for WQFN-8L 1.6x1.6
(COL) Packages
Copyright ©2012 Richtek Technology Corporation. All rights reserved.
DS9032-03 August 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
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