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PDF ADM7172 Data sheet ( Hoja de datos )
| Número de pieza | ADM7172 | |
| Descripción | Transient Response CMOS LDO | |
| Fabricantes | Analog Devices | |
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Data Sheet
6.5 V, 2 A, Ultralow Noise, High PSRR, Fast
Transient Response CMOS LDO
ADM7172
FEATURES
Input voltage range: 2.3 V to 6.5 V
Maximum load current: 2 A
Low noise: 5 µV rms independent of output voltage at
100 Hz to 100 kHz
Fast transient response: 1.5 μs for 1 mA to 1.5 A load step
60 dB PSRR at 100 kHz
Low dropout voltage: 172 mV at 2 A load, VOUT = 3 V
Initial accuracy: −0.5% (minimum), +1% (maximum)
Accuracy over line, load, and temperature: ±1.5%
Quiescent current, IGND = 0.7 mA with no load
Low shutdown current: 0.25 μA at VIN = 5 V
Stable with small 4.7 µF ceramic output capacitor
Adjustable and fixed output voltage options: 1.2 V to 5.0 V
Adjustable output from 1.2 V to VIN − VDO
Precision enable
Adjustable soft start
8-lead 3 mm × 3 mm LFCSP package
Supported by ADIsimPower tool
APPLICATIONS
Regulation to noise sensitive applications: ADC and DAC
circuits, precision amplifiers, PLLs/VCOs, and clocking ICs
Communications and infrastructure
Medical and healthcare
Industrial and instrumentation
GENERAL DESCRIPTION
The ADM7172 is a CMOS, low dropout linear regulator (LDO)
that operates from 2.3 V to 6.5 V and provides up to 2 A of output
current. This high output current LDO is ideal for regulation of
high performance analog and mixed-signal circuits operating
from 6 V down to 1.2 V rails. Using an advanced proprietary
architecture, the device provides high power supply rejection
and low noise, and achieves excellent line and load transient
response with just a small 4.7 µF ceramic output capacitor. Load
transient response is typically 1.5 μs for a 1 mA to 1.5 A load step.
The ADM7172 is available in 17 fixed output voltage options.
The following voltages are available from stock: 1.3 V, 1.8 V,
2.5 V, 3.0 V, 3.3 V, 4.2 V, and 5.0 V. Additional voltages that are
available by special order are: 1.5 V, 1.85 V, 2.0 V, 2.2 V, 2.7 V,
2.75 V, 2.8 V, 2.85 V, 3.8 V, and 4.6 V. An adjustable version is
also available that allows output voltages that range from 1.2 V
to VIN − VDO with an external feedback divider.
Inrush current can be controlled by adjusting the start-up time
via the soft start pin. The typical start-up time with a 1 nF soft
start capacitor is 1.0 ms.
Rev. A
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibilityisassumedbyAnalogDevices for itsuse,nor foranyinfringementsofpatentsor other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
TYPICAL APPLICATION CIRCUIT
VIN = 5V
CIN
4.7µF
ON
OFF
ADM7172
VIN VOUT
VIN VOUT
SENSE
EN SS
GND
VOUT = 3.3V
COUT
4.7µF
CSS
1nF
Figure 1. ADM7172 with Fixed Output Voltage, 3.3 V
The ADM7172 regulator output noise is 5 μV rms, independent
of the output voltage. The ADM7172 is available in an 8-lead,
3 mm × 3 mm LFCSP, making it not only a very compact
solution, but also providing excellent thermal performance for
applications requiring up to 2 A of output current in a small,
low profile footprint.
Figure 2. Transient Response (Trace 2), 1 mA to 1.5 A Load Step in 400 ns
(Trace 1)
Table 1. Related Devices
Device Input Voltage
ADM7170 2.3 V to 6.5 V
ADM7171 2.3 V to 6.5 V
Output Current
500 mA
1A
Package
8-lead LFCSP
8-lead LFCSP
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2014 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
1 page  
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
VIN to GND
VOUT to GND
EN to GND
SS to GND
SENSE to GND
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
Rating
−0.3 V to +7 V
−0.3 V to VIN
−0.3 V to +7 V
−0.3 V to VIN
−0.3 V to +7 V
−65°C to +150°C
−40°C to +125°C
JEDEC J-STD-020
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADM7172 can be damaged when the
junction temperature limits are exceeded. Monitoring ambient
temperature does not guarantee that TJ is within the specified
temperature limits. In applications with high power dissipation
and poor thermal resistance, the maximum ambient
temperature may need to be derated.
In applications with moderate power dissipation and low
printed circuit board (PCB) thermal resistance, the maximum
ambient temperature can exceed the maximum limit provided
that the junction temperature is within specification limits. The
junction temperature (TJ) of the device is dependent on the
ambient temperature (TA), the power dissipation of the device
(PD), and the junction-to-ambient thermal resistance of the
package (θJA).
Maximum junction temperature (TJ) is calculated from the
ambient temperature (TA) and power dissipation (PD) using the
formula
TJ = TA + (PD × θJA)
Junction-to-ambient thermal resistance (θJA) of the package is
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
ADM7172
the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θJA may vary, depending on
PCB material, layout, and environmental conditions. The
specified values of θJA are based on a 4-layer, 4 in. × 3 in. circuit
board. See JESD51-7 and JESD51-9 for detailed information on
the board construction. For additional information, see the
AN-617 Application Note, Wafer Level Chip Scale Package,
available at www.analog.com.
ΨJB is the junction-to-board thermal characterization parameter
with units of °C/W. ΨJB of the package is based on modeling and
calculation using a 4-layer board. The JESD51-12, Guidelines for
Reporting and Using Electronic Package Thermal Information,
states that thermal characterization parameters are not the same
as thermal resistances. ΨJB measures the component power
flowing through multiple thermal paths rather than a single
path as in thermal resistance, θJB. Therefore, ΨJB thermal paths
include convection from the top of the package as well as
radiation from the package, factors that make ΨJB more useful
in real-world applications. Maximum junction temperature (TJ)
is calculated from the board temperature (TB) and power
dissipation (PD) using the formula
TJ = TB + (PD × ΨJB)
See JESD51-8 and JESD51-12 for more detailed information
about ΨJB.
THERMAL RESISTANCE
θJA, θJC, and ΨJB are specified for the worst-case conditions, that
is, a device soldered in a circuit board for surface-mount
packages.
Table 5. Thermal Resistance
Package Type
θJA θJC ΨJB Unit
8-Lead LFCSP
36.4 23.5 13.3 °C/W
ESD CAUTION
Rev. A | Page 5 of 23
5 Page 
Data Sheet
4.5
ILOAD = 100µA
4.0 ILOAD = 10mA
ILOAD = 100mA
3.5
ILOAD = 500mA
ILOAD = 1000mA
3.0 ILOAD = 2000mA
2.5
2.0
1.5
1.0
0.5
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
VIN (V)
Figure 28. Ground Current vs. Input Voltage (VIN), Adjustable Version,
VOUT = 1.2 V
1.2
VIN = 3.0V
VIN = 4.0V
VIN = 5.0V
VIN = 6.0V
1.1 VIN = 6.5V
1.0
0.9
0.8
–40
–5 25 85
TEMPERATURE (°C)
125
Figure 29. Soft Start Current vs. Temperature, Different Input Voltages,
VOUT = 5 V
0
–20
–40
–60
800mV
700mV
600mV
–80 500mV
400mV
300mV
200mV
–100
160mV
1 10 100 1k 10k 100k 1M 10M
FREQUENCY (Hz)
Figure 30. Power Supply Rejection Ratio (PSRR) vs. Frequency, VOUT = 3 V,
2 A Load Current, Various Headroom Voltages
ADM7172
0
–20
–40
–60
10Hz
100Hz
1kHz
–80 10kHz
100kHz
1MHz
–100
10MHz
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
HEADROOM (V)
Figure 31. Power Supply Rejection Ratio (PSRR) vs. Headroom, VOUT = 3 V,
2 A Load Current, Different Frequencies
0
ILOAD = 200mA
ILOAD = 500mA
ILOAD = 1.0A
–20 ILOAD = 1.5A
ILOAD = 2.0A
–40
–60
–80
–100
1
10 100 1k 10k 100k 1M 10M
FREQUENCY (Hz)
Figure 32. Power Supply Rejection Ratio (PSRR) vs. Frequency, 800 mV
Headroom, VOUT = 3 V
0
ILOAD = 200mA
ILOAD = 500mA
ILOAD = 1.0A
–20 ILOAD = 1.5A
ILOAD = 2.0A
–40
–60
–80
–100
1
10 100 1k 10k 100k 1M 10M
FREQUENCY (Hz)
Figure 33. Power Supply Rejection Ratio (PSRR) vs. Frequency, 400 mV
Headroom, VOUT = 3 V
Rev. A | Page 11 of 23
11 Page | ||
| Páginas | Total 23 Páginas | |
| PDF Descargar | [ Datasheet ADM7172.PDF ] | |
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