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SP3012-04HTG Datasheet PDF - Littelfuse

Part Number SP3012-04HTG
Description TVS Diode Arrays
Manufacturers Littelfuse 
Logo Littelfuse Logo 



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SP3012-04HTG datasheet, circuit
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3012 Series
SP3012 Series 0.5pF Diode Array for USB3.0
RoHS Pb GREEN
Pinout
4 56
*Pins 6, 7, 9, 10 are not internally connected
but should be connected to the trace.
678
9 10
321
SP3012-03UTG
543
21
SP3012-04UTG (AEC-Q101 Qualified)
65
4
8 14
71
SP3012-06UTG (AEC-Q101 Qualified)
*Pins 1, 2, 3, 4, 5, 6, 7 are not internally connected
but should be connected to the opposite pin
with the PCB trace.
12
SP3012-04HTG
Functional Block Diagram
SP3012-03UTG
SP3012-06UTG
PIN 1
PIN 4
PIN 5
PIN 11
PIN 12
PIN 13
PIN 14
3
PIN 8
PIN 9
GND (PIN 2)
SP3012-04UTG
PIN 10
SP3012-04HTG
PIN 1
PIN 2
PIN 4
PIN 5
PIN 1
PIN 3
PIN 4
PIN 6
GND (PIN 3, 8)
Additional Information
GND (PIN 2)
Description
The SP3012 Series integrates either 3, 4 or 6 channels of
ultra low capacitance rail-to-rail diodes and an additional
zener diode to provide protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust devices can safely absorb repetitive
ESD strikes above the maximum level specified in the
IEC61000-4-2 international standard (±8kV contact
discharge) without performance degradation.
The extremely low loading capacitance also makes it ideal
for protecting high speed signal lines such as USB3.0,
HDMI, USB2.0, and eSATA.
Features
• ESD, IEC61000-4-2,
±12kV contact, ±25kV air
• EFT, IEC61000-4-4, 40A
(tP=5/50ns)
• Lightning, IEC61000-4-5,
4A (tP=8/20μs)
• Low capacitance of 0.5pF
(TYP) per I/O
• Low leakage current of
1.5μA (MAX) at 5V
• Small form factor μDFN
(JEDEC MO-229) and
SOT23-6 (JEDEC MO-
178AB) packages provide
flow through routing to
simplify PCB layout
• AEC-Q101 Qaulified
(μDFN10 and μDFN14)
Applications
• LCD/PDP TVs
• External Storages
• DVD/Blu-ray Players
• Desktops
• MP3/PMP
• Set Top Boxes
• Smartphones
• Ultrabooks/Notebooks
• Digital Cameras
Application Example for USB3.0
USB Port
VBUS
USB Controller
SSTX+
SSTX-
SSRX+
SSRX-
GND
D+
D-
SP3012-06UTG
IC
Signal GND
Datasheet
Resources
Samples
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/21/14

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SP3012-04HTG equivalent
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3012 Series
Package Dimensions — μDFN-6
Top View
D
6 54
A
L
Bottom View
D2
4 56
0.05 C
0.05 C
Pin 1 Index Area
1 23
0.05 C
A
E
E2
B
3 21
Pin 1 chamfer
0.10 x 45’
Side View
A1
A3
Seating plane
C
b
0.10 M C A B
0.05 M C
Package
JEDEC
Symbol
A
A1
A3
b
D
D2
E
E2
e
L
μDFN-6 (1.6x1.6x0.5mm)
MO-229
Millimeters
Inches
Min Max
0.45 0.55
0.00
0.05
0.152Ref
0.20 0.30
1.55 1.65
1.05 1.30
1.50 1.70
0.40 0.65
0.50 BSC
0.164
0.316
Min Max
0.018
0.022
0.000
0.002
0.006 Ref
0.008
0.012
0.061
0.065
0.042
0.052
0.060
0.067
0.016
0.026
0.020BSC
0.006
0.012
Embossed Carrier Tape & Reel Specification — μDFN-6
P2 t
D1 P0
A0
User Feeding Direction
Symbol
E
F
D1
D
P0
10P0
W
P2
A0
B0
K0
t
Millimetres
Min Max
1.65 1.85
3.45 3.55
1.00 1.25
1.50 MIN
3.90 4.10
40.0+/- 0.20
7.90 8.30
1.95 2.05
1.78 1.88
1.78 1.88
0.84 0.94
0.25 TYP
Inches
Min Max
0.06 0.07
0.14 0.14
0.04 0.05
0.06 MIN
0.15 0.16
1.57+/-0.01
0.31 0.33
0.08 0.08
0.07 0.07
0.07 0.07
0.03 0.04
0.01 TYP
Pin 1 Location
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/21/14

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Information Total 8 Pages
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