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PDF AX3007C Data sheet ( Hoja de datos )

Número de pieza AX3007C
Descripción 2A PWM Buck DC/DC Converter
Fabricantes AXElite 
Logotipo AXElite Logotipo



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AX3007C
52KHz, 2A PWM Buck DC/DC Converter
GENERAL DESCRIPTION
The AX3007C series are monolithic IC designed for a step-down DC/DC converter,
and own the ability of driving a 2A load without additional transistor. It saves board space.
The external shutdown function can be controlled by logic level and then come into standby
mode. The internal compensation makes feedback control having good line and load
regulation without external design. Regarding protected function, thermal shutdown is to
prevent over temperature operating from damage, and current limit is against over current
operating of the output switch. If current limit function occurs and VFB is down below 0.4V,
the switching frequency will be reduced.
The AX3007C series operates at a switching frequency of 52KHz thus allow smaller
sized filter components than what would be needed with lower frequency switching
regulators. The output version is an adjustable type. The chips are available in standard
SOP8, SOP-8L-EP, TO252-5L and TO263-5L packages.
FEATURES
- Output voltage: adjustable and fixed output versions.
- Adjustable version output voltage range is VFB to 38V.
- 52KHz fixed switching frequency.
- Voltage mode non-synchronous PWM control.
- Thermal-shutdown and current-limit protection.
- ON/OFF shutdown control input.
- Short Circuit Protect (SCP).
- Operating voltage can be up to 40V.
- Output load current is up to 2A.
- SOP-8L, SOP-8L-EP, TO252-5L and TO263-5L Pb-Free packages.
- Low power standby mode.
- Built-in switching transistor on chip.
BLOCK DIAGRAM
EN
200mV
CURRENT
SOURCE
BIAS
1.242V
REFERENCE
VOUT/FB
2.5V
REGULATOR
START
UP
220mV
52kHz
OSC.
+
COMP_.
Current
limit
COMP.
+
V CC
+
_AMP
COMP.
+
COMP.
CONTROL
+
DRIVER
Thermal
Shutdown
2A
SWITCH
SW
Vss
1/11
Axelite Confidential Materials, do not copy or distribute without written consent.
Rev.1.3 Jul.29, 2010

1 page




AX3007C pdf
AX3007C
SW
Internal switch. The voltage at this pin switches between (+VCC – VSAT) and
approximately – 0.5V, with a duty cycle of approximately VOUT / VCC. To minimize coupling
to sensitive circuitry, the PC board copper area connected to this pin should be minimized.
Feedback (adjustable version only)
Sense the regulated output voltage to complete the feedback loop.
EN
Allow the switching regulator circuit to be shutdown using logic level signals thus
dropping the total input supply current to approximately 100uA. Pulling this pin below a
threshold voltage of approximately 1.3V turns the regulator on, and pulling this pin above
1.3V (up to a maximum of VCC) shuts the regulator down. If this shutdown feature is not
needed, the EN pin can be wired to the ground pin.
Thermal Considerations
The SOP-8 package needs a heat sink under most conditions. The size of the heat
sink depends on the input voltage, the output voltage, the load current and the ambient
temperature. The AX3007C junction temperature rises above ambient temperature for a 2A
load and different input and output voltages.
The data for these curves was taken with the AX3007C (SOP-8 package) operating
as a buck-switching regulator in an ambient temperature of 25°C (still air). These
temperature increments are all approximate and are affected by many factors. Higher
ambient temperatures require more heat sinker.
For the best thermal performance, wide copper traces and generous amounts of
printed circuit board copper (need connect to the VSS pins) should be used in the board
layout, (One exception is the SW(switch) pin, which should not have large areas of copper.)
Large areas of copper provide the best transfer of heat (lower thermal resistance) to the
surrounding air, and moving air lowers the thermal resistance even further.
Package thermal resistance and junction temperature increments are all approximate.
The increments are affected by a lot of factors. Some of these factors include board size,
shape, thickness, position, location, and even board temperature. Other factors are, trace
width, total printed circuit copper area, copper thickness, single or double-sided, multi-layer
board and the amount of solder on the board.
The effectiveness of the PC board to dissipate heat also depends on the size,
quantity and spacing of other components on the board, as well as whether the
surrounding air is still or moving. Furthermore, some of these components such as the
catch diode will add heat to the PC board and the heat can vary as the input voltage
changes. For the inductor, depending on the physical size, type of core material and the
DC resistance, it could either act as a heat sink taking heat away from the board, or it could
add heat to the board.
5/11
Axelite Confidential Materials, do not copy or distribute without written consent.
Rev.1.3 Jul.29, 2010

5 Page





AX3007C arduino
(4) TO263-5L
E
AX3007C
10.9
eb
1.0 1.71
Land Pattern Recommendation
(Unit: mm)
C
L1
Symbol
Dimensions in Millimeters
Min. Nom. Max.
A 4.06 4.45
4.83
b 0.51 0.76 0.99
C 0.38 0.56
0.74
C2 1.14
1.4
1.65
D 8.38 9.02
9.65
E 9,65 10.2
10.7
e 1.70 BSC
L 14.6 15.2
15.9
L1 1.78
2.29
2.79
L2 -
- 1.68
Mold flash shall not exceed 0.005inch per side
JEDEC outline: TO-263 BA
Dimensions in Inches
Min. Nom. Max.
0.16 0.175 0.19
0.02 0.03 0.039
0.015
0.022
0.029
0.045
0.055
0.065
0.33 0.355 0.38
0.38 0.4 0.42
0.067 BSC
0.575 0.6 0.625
0.07 0.09 0.11
- - 0.066
11/11
Axelite Confidential Materials, do not copy or distribute without written consent.
Rev.1.3 Jul.29, 2010

11 Page







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