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PDF TA8409SG Data sheet ( Hoja de datos )
| Número de pieza | TA8409SG | |
| Descripción | BRIDGE DRIVER | |
| Fabricantes | Toshiba Semiconductor | |
| Logotipo |  |
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TA8409S/SG, F/FG
TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic
TA8409S/SG, TA8409F/FG
Bridge Driver
The TA8409S/SG and TA8409F/FG are bridge drivers with
output voltage control.
Features
z Modes available (CW/CCW/STOP/BRAKE)
z Output current up to 0.4 A (AVE) and 1.0 A (PEAK)
z Wide range of operating voltages
VCC (opr.) = 4.5 to 20 V
VS (opr.) = 0 to 20 V
Vref (opr.) = 0 to 20 V (Vref ≤ VS)
z Built-in thermal shutdown
z Standby mode available (STOP MODE)
z Hysteresis for all inputs.
TA8409S/SG
TA8409F/FG
TA8409FG/SG:
The TA8409FG/SG is a Pb-free product.
The following conditions apply to solderability:
*Solderability
1. Use of Sn-63Pb solder bath
*solder bath temperature = 230°C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0 Ag-0.5 Cu solder bath
*solder bath temperature = 245°C
*dipping time = 5 seconds
*the number of times = once
*use of R-type flux
Weight
SIP9−P−2.54A: 0.92 g (typ.)
SSOP10−P−225−1.00: 0.09 g (typ.)
1 2003-08-12
1 page  
Test Circuit 1
ICC1, ICC2, ICC3
TA8409S/SG, F/FG
TA8409S/SG, F/FG
Test Circuit 2
VIN1, VIN2, IIN, ∆VT, Iref
TA8409S/SG, F/FG
TA8409S/SG, TA8409F/FG
5 2003-08-12
5 Page 
Notes on Contents
TA8409S/SG, F/FG
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagrams may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Maximum Ratings
The absolute maximum ratings of a semiconductor device are a set of specified parameter values which must
not be exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the device electrical characteristics may be irreparably
altered and the reliability and lifetime of the device can no longer be guaranteed.
Moreover, these operations with exceeded ratings may cause breakdown, damage and/or degradation to other
equipment. Applications using the device should be designed so that each maximum rating will never be
exceeded in any operating conditions.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set
forth in this document.
5. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
6. Test Circuits
Components in the test circuits are only used to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application
equipment.
About the handling of ICs
Install the product correctly to avoid breakdown, damage and/or degradation to the product or equipment.
About over-current protection and heat protection circuits
These protection functions are intended to guard against certain output short circuits or other abnormal
conditions with only temporary effect, and are not guaranteed to prevent the IC from being damaged.
These protection features may not be effective if the product is operated outside the guaranteed operating
ranges, and some output short circuits may result in the IC being damaged.
The overcurrent protection feature is only intended to protect the IC from a temporary short circuit.
Short circuits of longer duration may damage the IC through undue stress. The systems must be configured
so that any overcurrent condition will be eliminated as soon as possible.
11 2003-08-12
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet TA8409SG.PDF ] | |
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