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What is 269-D?

This electronic component, produced by the manufacturer "AgereSystems", performs the same function as "269-Type1480nmPumpLaserModule".


269-D Datasheet PDF - AgereSystems

Part Number 269-D
Description 269-Type1480nmPumpLaserModule
Manufacturers AgereSystems 
Logo AgereSystems Logo 


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Data Sheet
June 2001
269-Type 14xx nm DFB Pump Laser Module
Description
The 269-type DFB pump laser module is designed as a
continuous-wave (CW) optical pump source for erbium-doped
fiber amplifiers.
Features
s Low relative intensity noise (RIN)
s High-coupled rated output power up to 280 mW,
CW
s Wide environmental range
s Field-proven packaging technology
s InGaAsP/InP high-power, strained multiple quan-
tum-well (MQW), distributed-feedback (DFB) laser
chip design
s Internal optical isolator (optional)
s Internal thermoelectric cooler (TEC)
s InGaAs PIN photodetector back-facet monitor
s Single-mode and polarization-maintaining fiber pig-
tails
s Compact, 14-pin butterfly package
s Industry compatible package and pinout
Applications
s Raman pump modules (RPM), copropagating and
counterpropagating
s Erbium-doped fiber amplifiers (EDFA)
The 269-type DFB pump laser module represents a
family of thermoelectrically cooled, high-power
lasers. These devices achieve stable wavelength
performance within the 1420 nm to 1510 nm range,
over the full operating temperature range. They are
designed as continuous-wave (CW) optical pump
sources for dense wavelength-division multiplexing
(DWDM) EDFA and Raman applications operating in
the C- and L-bands.
These new high-power DFB products represent a
breakthrough in 14xx nm pump laser technology by
integrating the beneficial characteristics of an exter-
nal FBG laser design (such as stimulated Brillouin
scattering suppression) with the superior relative-
intensity noise (RIN) performance of a DFB laser.
The combination of both characteristics is critical to
enable copropagating Raman pumping, which dis-
tributes gain over the first few kilometers of the trans-
mission fiber. The typical RIN value Agere Systems’
DFB lasers is –158 dB/Hz, a major improvement over
comparable external FBG-stabilized lasers with a
typical RIN of –125 dB/Hz. Integrating wavelength
stabilization into the chip improves the stabilization
over operating temperature and thereby eliminates
the need for an external FBG .
The laser modules incorporate a high-power, quan-
tum-well laser chip that achieves fiber powers up to
280 mW.
An integral thermoelectric cooler (TEC) stabilizes the
laser at room temperature and, combined with a her-
metic environment, allows the device to achieve
high-power operation over the extended temperature
range of 0 °C to 75 °C. An internal InGaAs PIN pho-
todiode, mounted behind the laser diode, functions
as the laser detector and monitors light emissions
from the rear facet of the laser.
The 269-type DFB module is offered in a 14-pin, her-
metic butterfly package.

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269-D equivalent
Data Sheet
June 2001
User Information
Table 4. Pin Information
Pin
Number
Connection
1 TE Cooler (+)*
2 Thermistor
3 Monitor Anode (–Bias)
4 Monitor Cathode (+Bias)
5 Thermistor
6 No Connect
7 No Connect
8 No Connect
9 No Connect
10 Laser Anode (+)
11 Laser Cathode (–)
12 No Connect
13 Package Ground
14 TEC Cooler (–)
* A positive input into this pin cools the laser.
Fiber Characteristics
s Length of fiber pigtail:
— 1.75 m ± 0.25 m
s Standard fiber:
— Cladding OD: 125 µm ± 2 µm
— Acrylate buffer OD: 250 µm ± 15 µm
— Cut off wavelength: <1320 nm
s Polarization-maintaining fiber:
— PANDA
— Cut off wavelength: <1400 nm
— Acrylate buffer: 400 µm
269-Type 14xx nm DFB Pump Laser Module
Mounting and Connections
CAUTION: This device is susceptible to damage as
a result of electrostatic discharge.
Proper precautions should be taken
during both handling and testing.
The base of the laser module (see Outline Diagram)
should be maintained at or below 75 °C (maximum)
during operation. Interfaces between the laser module
base and heat sink must be clean, and the use of a
thermal filler may be necessary.
Mounting Instructions
The minimum fiber bend radius is 1.0 in.
To avoid degradation in performance, mount the mod-
ule on the board as follows:
1. Place the bottom flange of the module on a flat heat
sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm)
in size. The surface finish of the heat sink should be
better than 32 µin. (0.8 µm), and the surface flat-
ness must be better than 0.001 in. (25.4 µm). Using
thermal conductive grease is optional; however,
thermal performance may be improved if conductive
grease is applied between the bottom flange and
the heat sink.
2. Mount four #2-56 screws with Fillister heads
(M2-3 mm) at the four screw hole locations (see
Outline Diagram). The Fillister head diameter must
not exceed 0.140 in. (3.55 mm). Do not apply more
than 1 in./lb. of torque to the screws.
Agere Systems Inc.
7 65 43 21
+–
TH 10 k
ISOLATOR
(OPTIONAL)
TEC
+–
8 9 10 11 12 13 14
Figure 1. Circuit Schematic
1-675 (F).i
5


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