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Número de pieza | D45H11FP | |
Descripción | Low Vcesat PNP Epitaxial Planar Transistor | |
Fabricantes | CYStech Electronics | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de D45H11FP (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
No Preview Available ! CYStech Electronics Corp.
Low Vcesat PNP Epitaxial Planar Transistor
D45H11FP
Spec. No. : C607FP
Issued Date : 2008.04.07
Revised Date : 2013.10.29
Page No. : 1/6
Features
• Low VCE(sat)
• High BVCEO
• Excellent current gain characteristics
• Pb-free lead plating package
Symbol
D45H11FP
Outline
TO-220FP
(C forming)
TO-220FP
(S forming)
B:Base
C:Collector
E:Emitter
BCE
BCE
Ordering Information
Device
D45H11FP-0-UB-S
Package
TO-220FP
(RoHS compliant package)
Shipping
50 pcs/tube, 20 tubes/box, 4 boxes / carton
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, UB : 50 pcs / tube, 20 tubes/box
Product rank, zero for no rank products
Product name
D45H11FP
CYStek Product Specification
http://www.Datasheet4U.com
1 page CYStech Electronics Corp.
TO-220FP (C Forming) Dimension
Marking:
Spec. No. : C607FP
Issued Date : 2008.04.07
Revised Date : 2013.10.29
Page No. : 5/6
Device Name
Date Code
D45H11
□□
3-Lead TO-220FP Plastic Package
CYStek Package Code: FP
Style: Pin 1.Base 2.Collector 3.Emitter
*Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A 0.169 0.185 4.300 4.700 E 0.583 0.598 14.800 15.200
A1 0.051 REF
1.300 REF
e
0.100*
2.540*
A2 0.110 0.126 2.800 3.200
F
0.106 REF
2.700 REF
A3 0.098 0.114 2.500 2.900 Φ
0.138 REF
3.500 REF
b 0.020 0.030 0.500 0.750 h 0.000 0.012 0.000 0.300
b1 0.043 0.053 1.100 1.350 L 1.102 1.118 28.000 28.400
b2 0.059 0.069 1.500 1.750 L1 0.067 0.075 1.700 1.900
c 0.020 0.030 0.500 0.750 L2 0.075 0.083 1.900 2.100
D 0.392 0.408 9.960 10.360
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
D45H11FP
CYStek Product Specification
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet D45H11FP.PDF ] |
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