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PDF D45H11E3 Data sheet ( Hoja de datos )
| Número de pieza | D45H11E3 | |
| Descripción | Low Vcesat PNP Epitaxial Planar Transistor | |
| Fabricantes | CYStech Electronics | |
| Logotipo |  |
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CYStech Electronics Corp.
Low Vcesat PNP Epitaxial Planar Transistor
D45H11E3
Spec. No. : C607E3
Issued Date : 2007.03.07
Revised Date : 2014.03.03
Page No. : 1/5
Features
• Low VCE(sat)
• High BVCEO
• Excellent current gain characteristics
• Pb-free lead plating package
Symbol
D45H11E3
Outline
TO-220AB
B：Base
C：Collector
E：Emitter
BCE
Ordering Information
Device
D45H11E3-0-UB-S
Package
TO-220
(Pb-free lead plating)
Shipping
50 pcs / tube, 20 tubes/ box , 4 boxes/carton
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, UB : 50 pcs / tube, 20 tubes/box
Product rank, zero for no rank products
Product name
D45H11E3
CYStek Product Specification
http://www.Datasheet4U.com
1 page  
CYStech Electronics Corp.
TO-220 Dimension
Marking:
Spec. No. : C607E3
Issued Date : 2007.03.07
Revised Date : 2014.03.03
Page No. : 5/5
Device Name
Date Code
D45H11
□□
1 23
3-Lead TO-220 Plastic Package
CYStek Package Code: E3
Style: Pin 1.Base 2.Collector 3.Emitter
4.Collector
DIM
Millimeters
Min. Max.
A 4.470 4.670
A1 2.520 2.820
b 0.710 0.910
b1 1.170 1.370
c 0.310 0.530
c1 1.170 1.370
D 10.010 10.310
E 8.500 8.900
Inches
Min. Max.
0.176 0.184
0.099 0.111
0.028 0.036
0.046 0.054
0.012 0.021
0.046 0.054
0.394 0.406
0.335 0.350
*: Typical
DIM
Millimeters
Min. Max.
Inches
Min. Max.
E1 12.060 12.460 0.475 0.491
e 2.540*
0.100*
e1 4.980 5.180 0.196 0.204
F 2.590 2.890 0.102 0.114
h 0.000 0.300 0.000 0.012
L 13.400 13.800 0.528 0.543
L1 3.560 3.960 0.140 0.156
Φ 3.735 3.935 0.147 0.155
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
D45H11E3
CYStek Product Specification
5 Page | ||
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