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PDF AN-0001 Data sheet ( Hoja de datos )
| Número de pieza | AN-0001 | |
| Descripción | Surface Mount Assembly and Handling | |
| Fabricantes | ANADIGICS | |
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Assembly of LPCC Packages
AN-0001
Surface Mount Assembly and Handling of
ANADIGICS LPCC Packages
1.0 Overview
ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC) package.
These LPCC packages have two types of pads, mounting pads and a thermal pad, both of which must be
correctly soldered for proper electrical contact to the PCB. The appropriate steps should be taken during
PCB design and assembly to guarantee optimum performance from the power amplifiers. This
application note outlines the steps necessary for the handling and assembly of ANADIGICS power
amplifiers.
2.0 Requirements
2.1 PCB Design Guidelines:
1. PCB land and solder masking recommendations are shown in Figure 1.
AB
SOLDER MASK
PCB THERMAL PAD
PCB LAND
SOLDER MASK OPENING
E
CD
A = Clearance from PCB thermal pad to solder mask opening, 0.0635 mm minimum
B = Clearance from edge of PCB thermal pad to PCB land, 0.2 mm minimum
C = Clearance from PCB land edge to solder mask opening to be as tight as
possible to ensure that some solder mask remains between PCB pads
D = PCB land length = LPCC solder pad length + 0.1mm
E = PCB land width = LPCC solder pad width
Figure 1. PCB Land and Solder Mask Recommendations.
05/2003
http://www.Datasheet4U.com
1 page  
AN-0001
3.4 Rework
1. A package rework tool with vacuum pick-up should be used.
2. A bottom PCB heater should be used to preheat the board within 1" of the rework site.
3. Excess solder must be removed before new part placement.
4. The new package should be placed using pick and place equipment.
5. Reflow conditions should be followed as mentioned before.
3.5 Solder Process Inspection
1. The vias on the back of the PCB should be filled with solder as an indication of good
connection of the LPCC thermal pad to the PCB. A thermal pad that is not soldered
properly may cause device failure and will accelerate the MTTF (Median Time To
Failures).
2. After reflow, verify that there is no bridging of solder to exposed circuitry, vias, or other
pins that could cause shorts and affect performance.
05/2003
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet AN-0001.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| AN-0001 | Surface Mount Assembly and Handling | ANADIGICS |
| AN-0002 | Biasing Circuits and Considerations | ANADIGICS |
| AN-0003 | Thermal Considerations | ANADIGICS |
| AN-0004 | 12mm Tape | ANADIGICS |
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