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PDF RF5623 Data sheet ( Hoja de datos )

Número de pieza RF5623
Descripción 3.3 TO 3.8 GHZ LINEAR POWER AMPLIFIER
Fabricantes RFMD 
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No Preview Available ! RF5623 Hoja de datos, Descripción, Manual

RF5623Single
5.0V, 3.3 to
3.8 GHz Linear
Power Ampli-
fier
RF5623
SINGLE 5.0V, 3.3 TO 3.8 GHZ
LINEAR POWER AMPLIFIER
Package Style: QFN, 16-Pin, 3mmx3mmx0.45mm
Features
High Gain; 32dB
2.5% EVM (RMS) at 26dBm,
5.0 V
Integrated Power Detector
High Impedance Enable
Integrated Input Match
Footprint compatible to RF5602
Applications
WiMAX Customer Premises
Equipment
WiMAX Access Points
IEEE 802.16 WiMAX Systems
16 15 14 13
BIAS VCC 1
12 RF OUT
RF IN 2
1st
Stage
Input
Match
2nd 3rd
Stage
Stage
Interstage
Match
Interstage
Match
11 RF OUT
PDOWN 3
10 RF OUT
Detector
Bias
VREG1 4
9 GND
5678
Functional Block Diagram
Product Description
The RF5623 is a linear power amplifier IC designed specifically for WiMAX
medium power applications. The device is manufactured on an advanced
InGaP Heterojunction Bipolar Transistor (HBT) process, and has been
designed for use as the final RF amplifier in 802.16e transmitters. The
device is provided in a 3mmx3mmx0.45mm, 16-pin, leadless chip carrier
with a backside ground. The RF5623 is designed to maintain linearity over
a wide range of conditions and power outputs.
DS120213
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MEMS
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
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RF5623 pdf
RF5623
PCB Metal Land and Solder Mask Pattern
Note: If it is desired to build the same PCB to accommodate the RF5602 as well as the RF5623/RF5603 use the following PCB
Patterns.
Note: Thermal vias for center slug “C” should be incorporated into the PCB design. The number and size of thermal vias will
depend on the application. Example of the number and size of vias can be found on the RFMD evaluation board layout.
DS120213
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
5 of 18
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RF5623 arduino
Evaluation Board Layout (RF5623HH)
RF5623
Assembly
Top
Inner 1
Inner 2
DS120213
Back
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
11 of 18
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