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PDF STPS1H100MF Data sheet ( Hoja de datos )

Número de pieza STPS1H100MF
Descripción High voltage power Schottky rectifier
Fabricantes STMicroelectronics 
Logotipo STMicroelectronics Logotipo




1. STPS1H100MF






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STPS1H100MF
High voltage power Schottky rectifier
Features
Negligible switching losses
High junction temperature capability
Low leakage current
Good trade-off between leakage current and
forward voltage drop
Avalanche capability specified
Description
Schottky rectifier designed for high frequency
miniature switch mode power supplies such as
adaptors and on-board DC/DC convertors. This
device is packaged in STmite flat.
A
K
STmite flat
(DO222-AA)
Table 1. Device summary
IF(AV)
VRRM
Tj (max)
VF (max)
1A
100 V
175 °C
0.62 V
May 2008
Rev 1
1/7
www.st.com
http://www.Datasheet4U.com

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STPS1H100MF pdf
STPS1H100MF
2 Package information
Package information
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 5. STmite flat dimensions
Dimensions
Ref. Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
L1 A 0.80 0.85 0.95 0.031 0.033 0.037
E1
L L2
b 0.40 0.55 0.65 0.016 0.022 0.026
Db
b2 0.70 0.85 1.00 0.027 0.033 0.039
b2
c 0.10 0.15 0.25 0.004 0.006 0.009
L3
E
c
D 1.75 1.90 2.05 0.069 0.075 0.081
E 3.60 3.80 3.90 0.142 0.150 0.154
A E1 2.80 2.95 3.10 0.110 0.116 0.122
L 0.50 0.55 0.80 0.020 0.022 0.031
L1 2.10 2.40 2.60 0.083 0.094 0.102
L2 0.45 0.60 0.75 0.018 0.024 0.030
L3 0.20 0.35 0.50 0.008 0.014 0.020
Figure 11. STmite flat recommended footprint (all dimensions in mm)
0.85 0.63 2.00 0.65
0.65 0.95 1.95
4.13
5/7
http://www.Datasheet4U.com

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