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PDF CT0603K25G Data sheet ( Hoja de datos )

Número de pieza CT0603K25G
Descripción Ceramic transient voltage suppressors
Fabricantes EPCOS 
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No Preview Available ! CT0603K25G Hoja de datos, Descripción, Manual

Ceramic transient voltage suppressors
SMD multilayer varistor, E series
Series/Type:
Ordering code:
Date:
Version:
CT0603K25G
B72500E0250K060
2011-12-06
5
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Identification/Classification 1
(header 1 + top left header bar):
Ceramic transient voltage suppressors
Identification/Classification 2
(header 2 + bottom left header bar):
SMD multilayer varistor, E series
Ordering code: (top right header bar)
B72500E0250K060
Series/Type: (top right header bar)
CT0603K25G
Preliminary data (optional):
(if necessary)
Department:
PPD ML PD
Date:
2011-12-06
Version:
5
Prepared by:
Dr. Mandoky-Lovas
Release signed by:
Dr. Dernovsek
Release signed QS:
Hr. Schlauer
Modifications/Remarks:
New Is Spec at 28V added
EPCOS AG 2011. Reproduction, publication and dissemination of this publication, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited

1 page




CT0603K25G pdf
Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72500E0250K060
CT0603K25G
Temperature derating
The specified ratings for Imax, Isurge,max and Pdiss,max are valid up to 150 °C.
For operation above 150 °C we recommend the below derating.
Dimensional drawing
w
k
MLV0031-M
Dimensions in mm
Case size l
0603
1.6 ±0.15
w
0.80 ±0.10
h
0.9 max.
k
0.10 … 0.40
Recommended solder pad layout
A Dimensions in mm
Case size
A
0603
1.00
B
1.00
C
1.00
MLV0034-P
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 13
2011-12-06

5 Page





CT0603K25G arduino
Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72500E0250K060
CT0603K25G
Storage
Only store CTVS in their original packaging. Do not open the package before storage.
Storage conditions in original packaging: temperature 25 to +45°C, relative humidity 75%
annual average, maximum 95%, dew precipitation is inadmissible.
Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise the
packaging material may be deformed or CTVS may stick together, causing problems during
mounting.
Avoid contamination of the CTVS surface during storage, handling and processing.
Avoid storing CTVS devices in harmful environments where they are exposed to corrosive
gases for example (SOx, Cl).
Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages.
Solder CTVS components after shipment from EPCOS within the time specified:
o CTVS with Ni barrier termination, 12 months
o CTVS with AgPd termination, 6 months
o SHCV and CU series, 24 months
Handling
Do not drop CTVS components and allow them to be chipped.
Do not touch CTVS with your bare hands - gloves are recommended.
Avoid contamination of the CTVS surface during handling.
Mounting
When CTVS devices are encapsulated with sealing material or overmolded with plastic
material, be sure to observe the precautions in “Mounting instructions”, “Sealing, potting and
overmolding”.
Make sure an electrode is not scratched before, during or after the mounting process.
Make sure contacts and housings used for assembly with CTVS components are clean before
mounting.
The surface temperature of an operating CTVS can be higher. Ensure that adjacent
components are placed at a sufficient distance from a CTVS to allow proper cooling.
Avoid contamination of the CTVS surface during processing.
Multilayer varistors (MLVs) with AgPd termination are not approved for lead-free soldering.
Soldering
Complete removal of flux is recommended to avoid surface contamination that can result in an
instable and/or high leakage current.
Use resin-type or non-activated flux.
Bear in mind that insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 13
2011-12-06

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