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PDF MLG0603Q0N4 Data sheet ( Hoja de datos )
| Número de pieza | MLG0603Q0N4 | |
| Descripción | SMD Inductors | |
| Fabricantes | TDK | |
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SMD Inductors(Coils)
For High Frequency(Multilayer)
Conformity to RoHS Directive
MLG Series MLG0603Q Type
FEATURES
• It serializes a product of acquisition inductance 0.3 to15nH. In a
product of 0.3 to 1.0nH, it realizes line up in a 0.1nH steppe.
• By the most suitable design, Q is higher than competing in a
conventional product MLG0603S type. In particular, Q in more
than 800MHz largely improved.
• Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
• The products contain no lead and also support lead-free
soldering.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS
0.6±0.03
0.06±0.04
PRODUCT IDENTIFICATION
MLG 0603 Q 2N2 S T
(1) (2) (3) (4) (5) (6)
(1) Multilayer ceramic chip coil
(2) Dimensions
0603
(3) Series name
(4) Inductance value
2N2
12N
(5) Inductance tolerance
B
C
S
H
J
(6) Packaging style
T
0.6× 0.3mm (L× W)
2.2nH
12nH
±0.1nH
±0.2nH
±0.3nH
±3%
±5%
Taping (reel)
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C [Unit of products]
0.15±0.05
Weight: 0.2mg
Dimensions in mm
RECOMMENDED PC BOARD PATTERN
0.2 to 0.3 0.25 to 0.35 0.2 to 0.3
Dimensions in mm
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
250 to 260˚C
230˚C
10s max.
Natural
cooling
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
15000 pieces/reel
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
180˚C
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
003-01 / 20070703 / e521_mlg0603q.fm
Free Datasheet http://www.datasheet4u.com/
1 page  
(5/6)
MLG Series MLG0603M Type (For Wireless LAN & Bluetooh)
FEATURES
• Nominal inductance values are supported from 0.6 to 10nH.
• Provides high Q characteristics.
• Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
The most suitable in high frequency circuit of 2.4GHz and 5GHz
wireless LAN & Bluetooh.
SHAPES AND DIMENSIONS
0.6±0.03
PRODUCT IDENTIFICATION
MLG 0603 M 2N2 B T
(1) (2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions
0603
(3) Material code
(4) Inductance value
2N2
5N6
(5) Inductance tolerance
B
H
(6) Packaging style
T
0.6× 0.3mm (L× W)
2.2nH
5.6nH
±0.1nH
±3%
Taping (reel)
0.06±0.04
0.15±0.05
Weight: 0.2mg
Dimensions in mm
RECOMMENDED PC BOARD PATTERN
0.2 to 0.3 0.25 to 0.35 0.2 to 0.3
Dimensions in mm
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C [Unit of products]
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
15000 pieces/reel
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
300°C. Soldering time should not exceed 3 seconds.
250 to 260˚C
230˚C
10s max.
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• All specifications are subject to change without notice.
003-01 / 20070703 / e521_mlg0603q.fm
Free Datasheet http://www.datasheet4u.com/
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MLG0603Q0N4.PDF ] | |
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