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PDF FG050605DNSWBG01 Data sheet ( Hoja de datos )
| Número de pieza | FG050605DNSWBG01 | |
| Descripción | TFT Module | |
| Fabricantes | Data Image | |
| Logotipo |  |
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Confidential Document
DATA IMAGE CORPORATION
TFT Module Specification
PRELIMINARY
ITEM NO.: FG050605DNSWBG01
Table of Contents
1. COVER & CONTENTS 1
2. RECORD OF REVISION 2
3. APPLICATION 3
4. GENERAL SPECIFICATIONS 3
5. ELECTRICAL CHARACTERISTICS 3
6. BLOCK DIAGRAM 4
7. PIN CONNECTIONS 5
8. INTERFACE SPECIFICATIONS 6
9. OPTICAL CHARACTERISTIC 9
10. QUALITY ASSURANCE 11
11. LOT NUMBERING SYSTEM 12
12. LCM NUMBERING SYSTEM 12
13. PRECAUTIONS IN USE LCM 13
14. OUTLINE DRAWING 14
15. PACKAGE INFORMATION 15
Customer Companies
Approved by
R&D Dept.
ALEX
Version:
1
Q.C. Dept.
ERIC
Issued Date:
2006/5/2
Eng. Dept.
PAUL
Sheet Code:
Prod. Dept.
HELEN
Total Pages:
15
FG050605DNSWBG01 REV:1
Page: 1 /15
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1 page  
7. PIN CONNECTIONS
7.1 P1 Input Pins Connection ( To TTL562 control board )
Confidential Document
Pin No
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Symbol
Function
GND Ground for logic circuit
CLK1 Data sampling clock
HS (HSYNC) Horizontal synchronous signal
VS (VSYNC) Vertical synchronous signal
GND Ground for logic circuit
R0 Red pixel data(LSB)
R1 Red pixel data
R2 Red pixel data
R3 Red pixel data
R4 Red pixel data
R5 Red pixel data(MSB)
GND Ground for logic circuit
G0 Green pixel data(LSB)
G1 Green pixel data
G2 Green pixel data
G3 Green pixel data
G4 Green pixel data
G5 Green pixel data(MSB)
GND Ground for logic circuit
B0 Blue pixel data(LSB)
B1 Blue pixel data
B2 Blue pixel data
B3 Blue pixel data
B4 Blue pixel data
B5 Blue pixel data(MSB)
GND Ground for logic circuit
DE Data Enable (connected to GND, if sync mode)
Vcc Power Supply : +3.3V
Vcc Power Supply : +3.3V
NC No Connection
NC No Connection
GND Ground for logic circuit
Remark
FG050605DNSWBG01 REV:1
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Confidential Document
10. QUALITY ASSURANCE
10.1 Test Condition
10.1.1 Temperature and Humidity(Ambient Temperature)
Temperature : 25 ± 5°C
Humidity
: 65 ± 5%
10.1.2 Operation
Unless specified otherwise, test will be conducted under function state.
10.1.3 Container
Unless specified otherwise, vibration test will be conducted to the product
itself without putting it in a container.
10.1.4 Test Frequency
In case of related to deterioration such as shock test.
only once.
It will be conducted
10.1.5 Test Method
No. Reliability Test Item & Level
1 High Temperature Storage Test
2 Low Temperature Storage Test
3 High Temperature Operation Test
4 Low Temperature Operation Test
High Temperature and High
5
Humidity Operation Test
6 Thermal Cycling Test
(No operation)
Vibration Test
7
(No operation)
8 Electrostatic Discharge Test
(No operation)
Test Level
T=(80)°C,240hrs
T=(-30)°C,240hrs
T=(80)°C,240hrs
T=(-30)°C,240hrs
T=60°C,90% RH,240hrs
(-30)°C → +25°C → (+80)°C,200 Cycles
30 min 5min 30 min
Frequency:0 ~ 55 Hz Amplitude:1.5 mm
Sweep Time:11min
Test Period:6 Cycles for each Direction of
X,Y,Z
150pF,330Ω
Air:± 15KV;Contact: ± 8KV
10 times/point;4 points/panel face
FG050605DNSWBG01 REV:1
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| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet FG050605DNSWBG01.PDF ] | |
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