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Número de pieza | HMC744LC3 | |
Descripción | FAST RISE TIME 1:2 FANOUT BUFFER | |
Fabricantes | Hittite | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de HMC744LC3 (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
No Preview Available ! HMC744LC3
v02.0312
14 Gbps, FAST RISE TIME 1:2 FANOUT BUFFER
w/ PROGRAMMABLE OUTPUT VOLTAGE & POSITIVE SUPPLY
Typical Applications
The HMC744LC3 is ideal for:
• RF ATE Applications
• Broadband Test & Measurement
• Serial Data Transmission up to 14 Gbps
• Clock Buffering up to 14 GHz
Functional Diagram
Features
Inputs Terminated Internally to 50 Ohms
Differential & Single-Ended Operation
Propagation Delay: 120 ps
Fast Rise and Fall Times: 22 / 20 ps
Programmable Differential
Output Voltage Swing: 600 - 1100 mV
Low Power Consumption: 287 mW typ.
Single Supply: +3.3 V
16 Lead Ceramic 3x3 mm SMT Package: 9 mm2
General Description
The HMC744LC3 is a 1:2 Fanout Buffer designed to
support data transmission rates up to 14 Gbps, and
clock frequencies as high as 14 GHz.
All differential inputs to the HMC744LC3 are CML and
terminated on-chip with 50 Ohms to the positive supply,
Vcc, and may be AC or DC coupled. The differential
CML outputs are source terminated to 50 Ohms and may
also be AC or DC coupled. Outputs can be connected
directly to a 50 Ohm Vcc-terminated system, while DC
blocking capacitors may be used if the terminating
system is 50 Ohms to ground. The HMC744LC3 also
features an output level control pin, VR, which allows
for loss compensation or signal-level optimization. the
HMC744LC3 operates from a single 3.3 V supply and
is available in ROHS-compliant 3x3 mm SMT package.
Electrical Specifications, TA = +25 ºC, Vcc = 3.3 V, VR = 3.3 V
Parameter
Conditions
Min.
Power Supply Voltage
3.0
Power Supply Current
Maximum Data Rate
Maximum Clock Rate
Input Voltage Range
Vcc - 1.5
Input Differential Range
0.1
Input Return Loss
Frequency <14 GHz
Output Amplitude
Single-Ended, peak-to-peak
Differential, peak-to-peak
Output High Voltage
Output Low Voltage
Output Rise / Fall Time
Single-Ended, 20% - 80%
Typ.
3.3
87
14
14
10
550
1100
3.29
2.74
22 / 20
Max
3.6
Vcc + 0.5
2
Units
V
mA
Gbps
GHz
V
Vp-p
dB
mVp-p
mVp-p
V
V
ps
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
1
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
Free Datasheet http://www.datasheet4u.com/
1 page HMC744LC3
v02.0312
14 Gbps, FAST RISE TIME 1:2 FANOUT BUFFER
w/ PROGRAMMABLE OUTPUT VOLTAGE & POSITIVE SUPPLY
Absolute Maximum Ratings
Power Supply Voltage (Vcc)
Input Signals
Output Signals
Continuous Pdiss (T = 85 °C)
(derate 17 mW/°C above 85 °C)
Thermal Resistance (Rth j-p) Worst
case junction to package paddle
Maximum Junction Temperature
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
Vcc -0.5 V to +3.75 V
Vcc -2.0 V to Vcc +0.5 V
Vcc -1.5 V to Vcc +0.5 V
0.68 W
59 °C/W
125 °C
-65 °C to +150 °C
-40 °C to +85 °C
Class 1C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA
2. LEAD AND GROUND PADDLE PLATING:
30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
5. PACKAGE WARP SHALL NOT EXCEED 0.05 mm DATUM -C-
6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
7. PADDLE MUST BE SOLDERED TO GND.
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
5
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
Free Datasheet http://www.datasheet4u.com/
5 Page |
Páginas | Total 8 Páginas | |
PDF Descargar | [ Datasheet HMC744LC3.PDF ] |
Número de pieza | Descripción | Fabricantes |
HMC744LC3 | FAST RISE TIME 1:2 FANOUT BUFFER | Hittite |
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