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PDF 16N03L Data sheet ( Hoja de datos )

Número de pieza 16N03L
Descripción RFD16N03L
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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No Preview Available ! 16N03L Hoja de datos, Descripción, Manual

SEMICONDUCTOR
RFD16N03L,
RFD16N03LSM
December 1995
16A, 30V, Avalanche Rated N-Channel Logic Level
Enhancement-Mode Power MOSFETs
Features
Packaging
• 16A, 30V
• rDS(ON) = 0.022
Temperature Compensating PSPICE Model
• Can be Driven Directly from CMOS, NMOS,
and TTL Circuits
DRAIN (FLANGE)
JEDEC TO-251AA
SOURCE
DRAIN
GATE
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• +175oC Operating Temperature
JEDEC TO-252AA
DRAIN (FLANGE)
Description
The RFD16N03L and RFD16N03LSM are N-channel power
MOSFETs manufactured using the MegaFET process. This
process, which uses feature sizes approaching those of
LSI circuits, gives optimum utilization of silicon, resulting in
outstanding performance. They were designed for use in
applications such as switching regulators, switching convert-
ers, motor drivers and relay drivers. This performance is
accomplished through a special gate oxide design which
provides full rated conductance at gate bias in the 3V - 5V
range, thereby facilitating true on-off power control directly
from logic level (5V) integrated circuits.
PACKAGE AVAILABILITY
PART NUMBER
PACKAGE
BRAND
RFD16N03L
TO-251AA 16N03L
RFD16N03LSM
TO-252AA 16N03L
Symbol
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GATE
SOURCE
DRAIN
GATE
SOURCE
NOTE: When ordering, use the entire part number. Add the suffix
9A, to obtain the TO-252AA variant in tape and reel, e.g.
RFD16N03LSM9A.
Formerly developmental type TA49030.
Absolute Maximum Ratings TC = +25oC
Drain-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS
Drain-Gate Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Gate-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
Drain Current
RMS Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .EAS
Power Dissipation
TC = +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Derate above +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TSTG, TJ
Soldering Temperature of Leads for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
RFD16N03L,
RFD16N03LSM
30
30
±10
16
Refer to Peak Current Curve
Refer to UIS Curve
90
0.606
-55 to +175
260
UNITS
V
V
V
A
W
W/oC
oC
oC
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper ESD Handling Procedures.
Copyright © Harris Corporation 1995
5-31
File Number 4013.1
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16N03L pdf
RFD16N03L, RFD16N03LSM
Typical Performance Curves (Continued)
2500
VGS = 0V, f = 1MHz
2000
1500
CISS
1000
500
COSS
CRSS
0
0 5 10 15 20 25
VDS, DRAIN-TO-SOURCE VOLTAGE (V)
FIGURE 13. TYPICAL CAPACITANCE vs VOLTAGE
200
100
STARTING TJ = +25oC
10 STARTING TJ = +150oC
If R = 0
tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)
If R 0
tAV=(L/R)ln[(IAS*R)/(1.3*RATED BVDSS-VDD) +1]
1
0.001
0.01
0.1
1
10
tAV, TIME IN AVALANCHE (ms)
100
FIGURE 14. UNCLAMPED INDUCTIVE SWITCHING. REFER TO
HARRIS APPLICATION NOTES AN9321 AND
AN9322
1.2
1.0
0.8
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0.6
0.4
0.2
0.0 0
25 50 75 100 125 150 175
TC, CASE TEMPERATURE (oC)
FIGURE 15. NORMALIZED POWER DISSIPATION vs TEMPERATURE DERATING CURVE
5-35
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