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Número de pieza | H50N03J | |
Descripción | N-Channel Enhancement-Mode MOSFET | |
Fabricantes | Hi-Sincerity Mocroelectronics | |
Logotipo | ||
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : MOS200514
Issued Date : 2005.01.01
Revised Date : 2005.10.14
Page No. : 1/5
H50N03J
N-Channel Enhancement-Mode MOSFET (25V, 50A)
Features
• RDS(on)=6mΩ@VGS=10V, ID=30A
• RDS(on)=9mΩ@VGS=4.5V, ID=30A
• Advanced trench process technology
• High Density Cell Design for Ultra Low On-Resistance
• Specially Designed for DC/DC Converters and Motor Drivers
• Fully Characterized Avalanche Voltage and Current
• Improved Shoot-Through FOM
H50N03J Pin Assignment
Tab 3-Lead Plastic TO-252
Package Code: J
Pin 1: Gate
3
2
1
Pin 2 & Tab: Drain
Pin 3: Source
D
Internal Schematic
Diagram
G
S
Maximum Ratings & Thermal Characteristics
(TA=25oC unless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current *1
Maximum Power Dissipation
TA=25oC
TA=75oC
Operating Junction and Storage Temperature Range
Avalanche Energy with Single Pulse
ID=50A, VDD=25V, L=0.1mH
Junction-to-Case Thermal Resistance
Junction-to-Ambient Thermal Resistance(PCB mounted)*2
*1: Maximum DC current limited by the package.
*2: 1-in2 2oz Cu PCB board
VDS
VGS
ID
IDM
PD
TJ,Tstg
EAS
RθJC
RθJA
Value
25
±20
50
350
70
42
-55 to 150
300
1.8
40
Units
V
V
A
A
W
W
oC
mJ
OC/W
OC/W
Switching
Test Circuit
VDD
VGEN
VIN
RG G
D
S
VOUT
Switching
Waveforms
td(on)
ton
tr td(off)
90%
toff
tf
90 %
Output, VOUT
Input, VIN 10%
10%
10%
Inverted
90%
50%
50%
Pulse Width
H50N03J
HSMC Product Specification
1 page www.DataSheet4U.net
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
TP
Ramp-up
tP
TL
Tsmax
tL
Tsmin
tS
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Time within 5oC of actual Peak
Temperature (tP)
Ramp-down Rate
Time 25oC to Peak Temperature
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb-Free devices.
Sn-Pb Eutectic Assembly
<3oC/sec
100oC
150oC
60~120 sec
<3oC/sec
183oC
60~150 sec
240oC +0/-5oC
10~30 sec
<6oC/sec
<6 minutes
Peak temperature
245oC ±5oC
260oC +0/-5oC
H50N03J
Spec. No. : MOS200514
Issued Date : 2005.01.01
Revised Date : 2005.10.14
Page No. : 5/5
Critical Zone
TL to TP
Pb-Free Assembly
<3oC/sec
150oC
200oC
60~180 sec
<3oC/sec
217oC
60~150 sec
260oC +0/-5oC
20~40 sec
<6oC/sec
<8 minutes
Dipping time
5sec ±1sec
5sec ±1sec
HSMC Product Specification
5 Page |
Páginas | Total 5 Páginas | |
PDF Descargar | [ Datasheet H50N03J.PDF ] |
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