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What is 3N165?

This electronic component, produced by the manufacturer "Micross", performs the same function as "Amplifier".


3N165 Datasheet PDF - Micross

Part Number 3N165
Description Amplifier
Manufacturers Micross 
Logo Micross Logo 


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3N165
P-CHANNEL MOSFET
The 3N165 is a monolithic dual enhancement mode P-Channel Mosfet
The 3N165 is a dual enhancement mode P-Channel
Mosfet and is ideal for space constrained applications
and those requiring tight electrical matching.
FEATURES 
DIRECT REPLACEMENT FOR INTERSIL 3N165 
ABSOLUTE MAXIMUM RATINGS1@ 25°C (unless otherwise noted) 
The hermetically sealed TO-78 package is well suited
for high reliability and harsh environment applications.
Maximum Temperatures 
Storage Temperature 
Operating Junction Temperature 
65°C to +200°C 
55°C to +150°C 
(See Packaging Information).
Lead Temperature (Soldering, 10 sec.) 
Maximum Power Dissipation 
+300°C 
3N165 Features:
Continuous Power Dissipation (one side) 
Total Derating above 25°C
300mW 
4.2 mW/°C 
ƒ Very high Input Impedance
ƒ Low Capacitance
MAXIMUM CURRENT
Drain Current 
50mA 
ƒ High Gain
ƒ High Gate Breakdown Voltage
ƒ Low Threshold Voltage
MAXIMUM VOLTAGES 
Drain to Gate or Drain to Source2 
Peak Gate to Source3
40V 
±125V 
GateGate Voltage 
±80V 
3N165 ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted)
SYMBOL 
CHARACTERISTIC 
MIN  TYP. 
MAX 
UNITS 
CONDITIONS 
IGSSR 
Gate Reverse Leakage Current 
‐‐ 
‐‐ 
10 
IGSSF 
Gate Forward Current  
‐‐  ‐‐  ‐10 
 
TA= +125°C 
‐‐ 
‐‐ 
25 
 
 
pA 
VGS = ‐0V 
VGS = ‐40V 
IDSS 
Drain to Source Leakage Current 
‐‐ 
‐‐  ‐200 
VDS = ‐20V 
ISDS 
Source to Drain Leakage Current 
‐‐ 
‐‐  ‐400 
VSD = ‐20V  VDB = 0 
ID(on) 
Drain Current “On” 
5.0  ‐‐ 
30 
mA 
VDS = ‐15V,  VGS = ‐10V 
VGS(th) 
Gate to Source Threshold Voltage  ‐2.0 
‐‐ 
5.0 
V 
VDS = ‐15V,   ID = ‐10µA 
2.0  ‐‐ 
5.0 
VDS =  VGS ,   ID = ‐10µA 
rDS(on) 
Drain to Source “On” Resistance 
‐‐ 
‐‐ 
300 
Ω 
VGS = ‐20V,   ID = ‐100µA 
gfs 
Forward Transconductance 
1500 
gos 
Output Admittance 
‐‐ 
Ciss 
 Input Capacitance 
‐‐ 
ClickCrss 
Reverse Transfer Capacitance 
‐‐ 
Coss 
Output Capacitance 
‐‐ 
RE(Yfs) 
Common Source Forward 
1200 
Transconductance 
To‐‐  3000 
‐‐  300 
‐‐  3 
‐‐  0.7 
‐‐  3.0 
‐‐  ‐‐ 
BuyµS  VDS = ‐15V,    ID = ‐10mA ,   f = 1kHz 
  
pF  VDS = ‐15V,    ID = ‐10mA ,   f = 1MHz4 
µS  VDS = ‐15V,    ID = ‐10mA ,   f = 100MHz4 
MATCHING CHARACTERISTICS 3N165                                                                                                                                      
SYMBOL 
LIMITS 
 
 
Yfs1/Yfs2  
CHARACTERISTIC 
Forward Transconductance Ratio 
MIN 
0.90 
MAX 
1.0 
UNITS 
ns 
CONDITIONS 
VDS = ‐15V,    ID = ‐500µA ,   f = MHz4 
VGS12 
Gate Source Threshold Voltage 
Differential 
‐‐  100 
mV 
VDS = ‐15V,    ID = ‐500µA 
VGS12/T 
Gate Source Threshold Voltage 
‐‐  100  µV/°C 
Differential Change with Temperature 
VDS = ‐15V,    ID = ‐500µA 
TA = ‐55°C to = +25°C 
  
 
 
  N  o  t  e    1   ‐   A   b  s o  l u  t  e    m   aSxWimIuTmCH raINtinGg sT EarSeT l iCmIRitiCnUg IvTa lues above which 3N165 serviceability may be impaired. *
SWITCHING WAVEFORM & TEST CIRCUIT
Note 2  Per Transistor 
Note 3  Device must not be tested at ±125V more than once or longer than 300ms. 
Note 4  For design reference only, not 100% tested
Available Packages:
Device Schematic
TO-78 (Bottom View)
3N165 in TO-72
3N165 in bare die.
Please contact Micross for full
package and die dimensions
Tel: +44 1603 788967
Web: http://www.micross.com/distribution
*To avoid possible damage to the device while wiring, testing, or in actual 
operation, follow these procedures: To avoid the buildup of static charge, the 
leads of the devices should remain shorted together with a metal ring except 
when being tested or used. Avoid unnecessary handling. Pick up devices by the 
case instead of the leads. Do not insert or remove devices from circuits with the 
power on, as transient voltages may cause permanant damage to the devices. 
Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.


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