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PDF NLU1G00 Data sheet ( Hoja de datos )

Número de pieza NLU1G00
Descripción Single 2-Input NAND Gate
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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No Preview Available ! NLU1G00 Hoja de datos, Descripción, Manual

NLU1G00
Single 2-Input NAND Gate
The NLU1G00 MiniGatet is an advanced highspeed CMOS
2input NAND gate in ultrasmall footprint.
The NLU1G00 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
Features
High Speed: tPD = 3.5 ns (Typ) @ VCC = 5.0 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
Power Down Protection Provided on inputs
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input and Output Pins
UltraSmall Packages
These are PbFree Devices
IN B 1
6 VCC
IN A 2
5 NC
GND 3
4 OUT Y
Figure 1. Pinout (Top View)
IN A
IN B
& OUT Y
Figure 2. Logic Symbol
PIN ASSIGNMENT
1 IN B
2 IN A
3 GND
4 OUT Y
5 NC
6 VCC
FUNCTION TABLE
Input
AB
Output
Y
LL
LH
HL
HH
H
H
H
L
www.onsemi.com
MARKING
DIAGRAMS
UDFN6
1.2 x 1.0
M
1 CASE 517AA
UDFN6
1.0 x 1.0
CASE 517BX
M
1
UDFN6
1.45 x 1.0
CASE 517AQ
1
T = Device Marking
M = Date Code
M
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
© Semiconductor Components Industries, LLC, 2016
June, 2016 Rev. 3
1
Publication Order Number:
NLU1G00/D

1 page




NLU1G00 pdf
NLU1G00
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA01
ISSUE D
D
PIN ONE
REFERENCE
2X
0.10 C
ÉÉÉÉ
2X TOP VIEW
0.10 C
0.10 C
10X 0.08 C
SIDE VIEW
13
A
B
E
(A3)
A
A1
5X L
EDGE OF PACKAGE
L1
DETAIL A
Bottom View
(Optional)
ÉÉÉÉÉÉEXPOSED Cu
MOLD CMPD
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D 1.20 BSC
E 1.00 BSC
e 0.40 BSC
L 0.30 0.40
A1 DETAIL B
Side View
(Optional)
L1 0.00 0.15
L2 0.40 0.50
SEATING
PLANE
C
MOUNTING FOOTPRINT*
6X
0.42
6X
0.22
L2
6X b
0.10
0.05
CAB
C NOTE 3
6
4
e
BOTTOM VIEW
0.40
PITCH
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5

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