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PDF SP3011 Data sheet ( Hoja de datos )

Número de pieza SP3011
Descripción Low Capacitance Diode Array
Fabricantes Littelfuse 
Logotipo Littelfuse Logotipo



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No Preview Available ! SP3011 Hoja de datos, Descripción, Manual

SPA™ Silicon Protection Array Products
Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection
HF RoHS Pb GREEN SP3011 Lead-Free/Green Series
Description
The SP3011 integrates six channels of ultra-low capacitance
rail-to-rail diodes and an additional zener diode to provide
protection for USB 3.0 ports that may experience
destructive electrostatic discharges (ESD). This high
density array can safely absorb repetitive ESD strikes at the
maximum level specified in the IEC61000-4-2 international
standard (Level 4, ±8kV contact discharge) without
performance degradation. It’s extremely low loading
capacitance makes it ideal for protecting any high-speed
signal pins.
Pinout
*Pins 1, 2, 3, 4, 5, 6, 7 are not internally connected but should be connected to the
opposite pin with the PCB trace.
Functional Block Diagram
Pin 11
Pin 12
Pin 13
Pin 14
Pin 8
Pin 9
GND
(Pin 10)
Features
t &4% *&$ œL7
contact, ±15kV air
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(5/50ns)
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(TYP) per I/O
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t 4NBMMGPSNGBDUPSV%'/
package saves board
space
Applications
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t.11.11MBZFS
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Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
www.DataSheet.in
85
Revised: May 10, 2010
SP3011 Lead-Free/Green Series

1 page




SP3011 pdf
SPA™ Silicon Protection Array Products
Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection
Part Numbering System
SP 3011 06 U T G
Silicon
Protection
Array
Series
G= Green
T= Tape & Reel
Number of
Channels
-06 = 6 Channels
Package
uDFN-14 (3.5x1.35mm)
Part Marking System
RH6
Product Series
R = SP3011
Number of
Channels
Assembly Site
Product Characteristics
Lead Plating
1SF1MBUFE'SBNF
Lead Material
$PQQFS"MMPZ
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
.PMEFE&QPYZ
Flammability
UL94-V-0
/PUFT
"MMEJNFOTJPOTBSFJONJMMJNFUFST
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
"MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF"
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Ordering Information
Part Number
4165(
Package
V%'/
Marking
3)
Min. Order Qty.
3000
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
www.DataSheet.in
89
Revised: May 10, 2010
SP3011 Lead-Free/Green Series

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