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PDF PIC18F25K22 Data sheet ( Hoja de datos )

Número de pieza PIC18F25K22
Descripción High-Performance Microcontrollers
Fabricantes Microchip Technology 
Logotipo Microchip Technology Logotipo



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No Preview Available ! PIC18F25K22 Hoja de datos, Descripción, Manual

PIC18(L)F2X/4XK22
Data Sheet
28/40/44-Pin, Low-Power,
High-Performance Microcontrollers
with XLP Technology
2010-2012 Microchip Technology Inc.
DS41412F

1 page




PIC18F25K22 pdf
Pin Diagrams (28-pin)
28-pin PDIP, SOIC, SSOP
MCLR/VPP/RE3
RA0
RA1
RA2
RA3
RA4
RA5
VSS
RA7
RA6
RC0
RC1
RC2
RC3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28-pin QFN, UQFN(1)
PIC18(L)F2X/4XK22
28 RB7/PGD
27 RB6/PGC
26 RB5
25 RB4
24 RB3
23 RB2
22 RB1
21 RB0
20 VDD
19 VSS
18 RC7
17 RC6
16 RC5
15 RC4
RA2
RA3
RA4
RA5/
VSS
RA7
RA6
28 27 26 25 24 23 22
1 21
2 20
3 19
4 PIC18(L)F2XK22 18
5 17
6 16
7 15
8 9 10 11 12 13 14
RB3
RB2
RB1
RB0
VDD
VSS
RC7
Note 1: The 28-pin UQFN package is available only for PIC18(L)F23K22 and PIC18(L)F24K22.
2010-2012 Microchip Technology Inc.
DS41412F-page 5

5 Page





PIC18F25K22 arduino
PIC18(L)F2X/4XK22
Table of Contents
1.0 Device Overview ....................................................................................................................................................................... 13
2.0 Oscillator Module (With Fail-Safe Clock Monitor)) .................................................................................................................... 27
3.0 Power-Managed Modes ............................................................................................................................................................ 47
4.0 Reset ......................................................................................................................................................................................... 59
5.0 Memory Organization ................................................................................................................................................................ 69
6.0 Flash Program Memory............................................................................................................................................................. 95
7.0 Data EEPROM Memory .......................................................................................................................................................... 105
8.0 8 x 8 Hardware Multiplier.......................................................................................................................................................... 111
9.0 Interrupts .................................................................................................................................................................................. 113
10.0 I/O Ports .................................................................................................................................................................................. 135
11.0 Timer0 Module ........................................................................................................................................................................ 159
12.0 Timer1/3/5 Module with Gate Control...................................................................................................................................... 163
13.0 Timer2/4/6 Module .................................................................................................................................................................. 175
14.0 Capture/Compare/PWM Modules ........................................................................................................................................... 179
15.0 Master Synchronous Serial Port (MSSP1 and MSSP2) Module .............................................................................................. 211
16.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) .............................................................. 267
17.0 Analog-to-Digital Converter (ADC) Module ............................................................................................................................. 297
18.0 Comparator Module.................................................................................................................................................................. 311
19.0 Charge Time Measurement Unit (CTMU)................................................................................................................................ 321
20.0 SR LATCH................................................................................................................................................................................. 337
21.0 Fixed Voltage Reference (FVR) .............................................................................................................................................. 343
22.0 Digital-to-Analog Converter (DAC) Module ............................................................................................................................. 345
23.0 High/Low-Voltage Detect (HLVD) ............................................................................................................................................ 349
24.0 Special Features of the CPU ................................................................................................................................................... 355
25.0 Instruction Set Summary ......................................................................................................................................................... 373
26.0 Development Support.............................................................................................................................................................. 423
27.0 Electrical Characteristics ......................................................................................................................................................... 427
28.0 DC and AC Characteristics Graphs and Tables ...................................................................................................................... 467
29.0 Packaging Information............................................................................................................................................................. 523
Appendix A: Revision History............................................................................................................................................................ 545
Appendix B: Device Differences........................................................................................................................................................ 546
Index ................................................................................................................................................................................................. 547
The Microchip Web Site .................................................................................................................................................................... 557
Customer Change Notification Service ............................................................................................................................................. 557
Customer Support ............................................................................................................................................................................. 557
Reader Response ............................................................................................................................................................................. 558
Product Identification System ........................................................................................................................................................... 559
2010-2012 Microchip Technology Inc.
DS41412F-page 11

11 Page







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