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PDF IP5306CX8 Data sheet ( Hoja de datos )
| Número de pieza | IP5306CX8 | |
| Descripción | Integrated Differential Microphone Filter | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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IP5306CX8
www.DataSheet4U.com
Integrated differential microphone filter with ESD protection
to IEC 61000-4-2 level 4
Rev. 01 — 12 February 2010
Product data sheet
1. Product profile
1.1 General description
The IP5306CX8 is a dual-channel RC low-pass filter array which is designed to provide
filtering of undesired RF signals. In addition, the IP5306CX8 incorporates diodes to
provide protection to downstream components from ElectroStatic Discharge (ESD)
voltages as high as ±15 kV contact according the IEC 61000-4-2 model, far exceeding
standard level 4.
IP5306CX8 is fabricated using monolithic silicon technology and integrates five resistors,
several diodes and four high density capacitors in a single Wafer-Level Chip-Scale
Package (WLCSP). These features make the IP5306CX8 ideal for use in applications
requiring the utmost in miniaturization such as mobile phone handsets, cordless
telephones and personal digital devices.
1.2 Features and benefits
Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)
Integrated differential microphone RC filter with high density capacitors
[2 × (0.8 nF + 1.5 nF)] and biasing resistor network
Integrated ESD protection withstanding ±15 kV contact discharge, far exceeding
IEC 61000-4-2 level 4
WLCSP with 0.4 mm pitch
1.3 Applications
Differential microphones in mobile phones and other portable electronics
1 page  
NXP Semiconductors
IP5306CX8www.DataSheet4U.com
Integrated differential microphone filter with ESD protection
7. Application information
7.1 Application diagram
A typical application diagram showing IP5306CX8 connected between a microphone and
the baseband ADC input pins is depicted in Figure 3. The 2 kV ESD compliant pins (A2,
A3, B3 and C3) are connected to the baseband interface side while the two 15 kV ESD
compliant pins (B1 and C1) are connected to the microphone.
B1
Sub
C1
hook detect
A3 A2
Sub
Rs
Rpu
Sub
Rs(ch)
IP5306CX8
microphone
bias
DC-decoupling
B3 capacitor
microphone
amplifier
C1 C2
Rs(ch)
DC-decoupling
C3 capacitor
ADC
Sub
C1 Rpd
Sub
C2
baseband
B2 C2
Fig 3. Typical application diagram of IP5306CX8
001aal187
IP5306CX8_1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 12 February 2010
© NXP B.V. 2010. All rights reserved.
5 of 15
5 Page 
NXP Semiconductors
IP5306CX8www.DataSheet4U.com
Integrated differential microphone filter with ESD protection
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
MSL: Moisture Sensitivity Level
Fig 11. Temperature profiles for large and small components
time
001aac844
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
9.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
9.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
9.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
IP5306CX8_1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 12 February 2010
© NXP B.V. 2010. All rights reserved.
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| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet IP5306CX8.PDF ] | |
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