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What is RM009?

This electronic component, produced by the manufacturer "SKYWORKS", performs the same function as "Power Amplifier Module".


RM009 Datasheet PDF - SKYWORKS

Part Number RM009
Description Power Amplifier Module
Manufacturers SKYWORKS 
Logo SKYWORKS Logo 


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RM009www.DataSheet4U.com
Power Amplifier Module for Dual-band GSM900 DCS1800
The RM009 is a dual-band Power Amplifier Module (PAM) designed in a compact
form factor for Class 4 GSM900 and Class 1 DCS1800 cellular handsets.
The module consists a GSM900 PA block and a DCS1800 PA block, matching
circuitry for 50 input and output impedances, and bias control circuitry. Two
separate Heterojunction Bipolar Transistor (HBT) PA blocks are fabricated on a
single Gallium Arsenide (GaAs) die. One PA block operates in the GSM900 band
and the other supports the DCS1800 band. The PAM is optimized for three-cell
operation with both PAs sharing common power supply pins to distribute
current. A custom CMOS integrated circuit contains a current amplifier that
minimizes the required power control current (IAPC) to 60 µA, typical.
RF input and output ports are internally matched to 50 to reduce the number of
external components for a dual-band design. Switching circuitry receives the
band select signal on the band select pin (BS) to switch between GSM (logic 0)
and DCS (logic 1). Analog Power Control (APC) controls the output power of
each PA selected by the band select signal. The extremely low leakage current
(2 µA, typical) of the RM009 dual-band module maximizes handset standby time.
Distinguishing Features
• High efficiency
GSM 54%
DCS 45%
• Input/output matching
50 internal
• Small outline
9.1 mm x 11.6 mm
• Low profile
1.50 mm ±10%
• Low APC current
60 µA
Applications
• Class 4 GSM900 and Class 1
DCS1800 dual-band cellular
handsets
The functional block diagram shows the relationship of the dual PAs and the
CMOS device in the RM009.
Functional Block Diagram
DCS IN
Power Control
Band Select
GSM IN
Match
CMOS
Bias
Controller
Match
Match
HBT
DCS OUT
Match
GSM OUT
Data Sheet
Skyworks Solutions, Inc. Proprietary
© 1999–2002, Skyworks Solutions, Inc., All Rights Reserved.
101258B
July 26, 2002

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RM009 equivalent
RM009
Package Dimensions and Pin Descriptions
Power Amplifier Module for Dual-band GSM900 DCS1800 Applications
Packagewww.DataSheet4U.com Dimensions and Pin Descriptions
Figure 2 is a mechanical diagram of the pad layout for the 16-pin leadless, RM009 Power
Amplifier module. Figure 3 shows the device pin configuration and the pin numbering convention,
which starts with pin 1 in the upper left and increments counter-clockwise around the package. Pin
assignments and their functional descriptions are listed in Table 4. Figure 4 shows typical case
markings.
Figure 2. RM009 PAM Package Dimensions—16-Pin Leadless Module (All Views)
PIN 1
R0.381 Typ
2.286 ± 0.051
0.762 Typ
R0.860 Typ
0.127 Ref
TOP VIEW
SIDE VIEW
NOTE(S):
1. All contact points are gold plated, lead free-surfaces.
2. All dimensions are in millimeters.
3.899
± 0.051
1.905
± 0.051
BOTTOM VIEW
11.60 +0.20/-0.08
1.02 Typ
FRONT VIEW
1.55 ± 10%
101058_004
101258B
July 26, 2002
Skyworks Solutions, Inc. Proprietary
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Part Details

On this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for RM009 electronic component.


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