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PDF BTD2150AE3 Data sheet ( Hoja de datos )
| Número de pieza | BTD2150AE3 | |
| Descripción | NPN Epitaxial Planar Transistor | |
| Fabricantes | Cystech Electonics | |
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CYStech Electronics Corp.
Low Vcesat NPN Epitaxial Planar Transistor
BTD2150AE3
Features
• Low VCE(sat), VCE(sat)=0.25 V (typical), at IC / IB = 2A / 50mA
• Excellent current gain characteristics
www.DataSh•eCet4oUm.cpomlementary to BTB1424AE3
Spec. No. : C848E3
Issued Date : 2004.07.06
Revised Date :
Page No. : 1/5
Symbol
BTD2150AE3
Outline
TO-220AB
B：Base
C：Collector
E：Emitter
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Base Current
Power Dissipation (TA=25℃)
Power Dissipation (TC=25℃)
Junction Temperature
Storage Temperature
Symbol
VCBO
VCEO
VEBO
IC
ICP
IB
PD
Tj
Tstg
Note : Pulse test, pulse width≤380µs, duty cycle≤2%.
BTD2150AE3
BCE
Limits
80
50
6
3
7 (Note)
1
1.8
25
150
-55~+150
Unit
V
V
V
A
A
W
°C
°C
CYStek Product Specification
1 page  
CYStech Electronics Corp.
TO-220AB Dimension
Spec. No. : C848E3
Issued Date : 2004.07.06
Revised Date :
Page No. : 5/5
A
D
B
E
www.DataSheet4U.com
G
I
4
P
H
3
2
1
M
O
3-Lead TO-220AB Plastic Package
CYStek Package Code: E3
Marking:
C
D2150A
K
N
Style: Pin 1.Base 2.Collector 3.Emitter
4.Collector
*: Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A 0.2197 0.2949 5.58 7.49
I
- *0.1508 -
*3.83
B 0.3299 0.3504 8.38 8.90
K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40
4.70
M 0.0449 0.0551 1.14
1.40
D 0.0453 0.0547 1.15 1.39
N
- *0.1000 -
*2.54
E 0.0138 0.0236 0.35
0.60
O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H
- *0.6398 -
*16.25
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTD2150AE3
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet BTD2150AE3.PDF ] | |
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