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PDF LE75181 Data sheet ( Hoja de datos )

Número de pieza LE75181
Descripción Ringing Access Switch
Fabricantes Zarlink Semiconductor 
Logotipo Zarlink Semiconductor Logotipo




1. LE75181






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No Preview Available ! LE75181 Hoja de datos, Descripción, Manual

Le75181
A Voice Solution
Ringing Access Switch
VE750 Series
APPLICATIONS
DESCRIPTION
„ Central office
„ DLC
„ PBX
„ DAML
„ HFC/FITL
www.DataSheeFt4EU.AcoTmURES
„ Small size/surface-mount packaging
„ Monolithic IC reliability
„ Low impulse noise
„ Make-before-break, break-before-make operation
„ Clean, bounce-free switching
„ Low, matched ON-resistance
„ Built-in current limiting, thermal shutdown, and SLIC
protection
„ 5 V only operation, very low power consumption
„ Battery monitor, all OFF state upon loss of battery
„ No EMI
„ Latched logic level inputs, no drive circuitry
„ Only one external protector required
„ TTL logic control compatible
„ Default power up state
RELATED LITERATURE
„ 081123 Le75282 Dual Intelligent Line Card Access
Switch Data Sheet
„ 081126 Le75183 Line Card Access Switch Data Sheet
„ 080754 Le58QL061/063 QLSLAC Data Sheet
„ 080676 Le5711 Dual SLIC Data Sheet
„ 081047 Le5712 Dual SLIC Data Sheet
The VoiceEdge™ family VE750 series of Line Card Access
Switches (LCAS) is a family of monolithic solid-state switches
that is designed to provide both power ringing access and test
access on the analog line card. These devices, while not a pin-
for-pin replacement for the traditional electromechanical relay
(EMR) solution, provide the equivalent switching functionality.
The VE750 series LCAS is meant as a solid-state alternative to
the EMRs.
The Le75181A/B device is pin-for-pin compatible with
Legerity’s L7581A/B device, and the Le75181C device is pin-
for-pin compatible with Legerity’s L8581A device.
Legerity also offers a range of compatible SLIC devices and
codec/filters that can be used with the VE750 series LCAS for
complete line card solutions that can be used worldwide in
analog line card applications.
BLOCK DIAGRAM
Le75181A/C
FGND
SCR
& Trip
Circuit
VBAT
TBAT
TLINE
TRINGING
SW3
VDD
TSD
SW1
SW2
Temperature
Shutdown
Le75181B
RBAT
RLINE
SW4
RRINGING
LATCH
INPUT
DGND
FGND
VBAT
ORDERING INFORMATION
TBAT
RBAT
Device
LE75181ABSC
LE75181BBSC
LE75181CBSC
Package Type1
16-Pin SOIC, GULL (Green)
Packing2
Tube
1. The green package meets RoHS Directive 2002/95/EC of the
European Council to minimize the environmental impact of
electrical equipment.
2. For delivery using a tape and reel packing system, add a "T" suffix
to the OPN (Ordering Part Number) when placing an order.
TLINE
SW3
SW1
TRINGING
SW2
SW4
VDD
TSD
Temperature Shutdown
RLINE
RRINGING
LATCH
INPUT
DGND
NOTE: On August 3, 2007, Zarlink Semiconductor acquired the products and Document ID# 081105 Date: Sep 18, 2007
technology of Legerity Holdings.
Rev:
Distribution:
E Version: 2
Public Document

1 page




LE75181 pdf
Le75181
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.
www.DataSheet4U.com
Package Assembly
Parameter
Operating Temperature Range
Storage Temperature Range
Relative Humidity Range
Pin Soldering Temperature (t=10 s max)
5-V Power Supply
Battery Supply
Logic Input Voltage
Input-to-output Isolation
Pole-to-pole Isolation (All except SW 4)
Pole-to-pole Isolation (Ringing Access Switch, SW4)
ESD Immunity (Human Body Model)
Min Max Unit
–40 110
°C
–40 150
°C
5 95 %
— 260 °C
-0.3 7
V
— –85
V
-0.3 VDD+0.3
V
— 330
V
— 330
V
— 480
V
JESD22 Class 1C compliant
Green package devices are assembled with enhanced, environmental compatible lead-free, halogen-free, and antimony-free
materials. The leads possess a matte-tin plating which is compatible with conventional board assembly processes or newer lead-
free board assembly processes. The peak soldering temperature should not exceed 245°C during printed circuit board assembly.
Refer to IPC/JEDEC J-Std-020B Table 5-2 for the recommended solder reflow temperature profile.
OPERATING RANGES
Environmental Ranges
Legerity guarantees the performance of this device over commercial (0 to 70º C) and industrial (-40 to 85ºC) temperature ranges
by conducting electrical characterization over each range and by conducting a production test with single insertion coupled to
periodic sampling. These characterization and test procedures comply with section 4.6.2 of Bellcore GR-357-CORE Component
Reliability Assurance Requirements for Telecommunications Equipment.
Ambient Temperature
40° to 85°C
Electrical Ranges
Supply
Min
Typ
Max Unit
VDD
VBAT*
4.5 5 5.5
V
–19 — –72
*VBAT is used only as a reference for internal protection circuitry. If VBAT rises above –10 V, the device will enter an all OFF state and remain in
this state until the battery voltage drops below –15 V.
5
Zarlink Semiconductor Inc.

5 Page





LE75181 arduino
Le75181
Data Sheet
protection device are given in the An Introduction to Le758X Series of Line Card Access Switches application note. Basic design
equations governing the choice of external secondary protector are given below:
|VBATmax| + |Vbreakovermax| < |Vbreakdownmin(break)|
|Vringingpeakmax| + |VBATmax| + |Vbreakovermax| < |Vbreakdownmin(ring)|
|Vringingpeakmax| + |VBATmax| < |Vbreakovermin|
where:
VBATmax—Maximum magnitude of battery voltage.
Vbreakovermax—Maximum magnitude breakover voltage of external secondary protector.
Vbreakovermin—Minimum magnitude breakover voltage of external secondary protector.
Vbreakdownmin(break)—Minimum magnitude breakdown voltage of Le75181 break switch.
Vbreakdownmin(ring)—Minimum magnitude breakdown voltage of Le75181 ring access switch.
Vringingpeakmax—Maximum magnitude peak voltage of ringing signal.
www.DataSheeSt4eUri.ecosmcurrent-limiting fused resistors or PTC resistors should be chosen so as not to exceed the current rating of the external
secondary protector. Refer to the manufacturer’s data sheet for specifications.
Table 7. Electrical Specifications, Protection Circuitry
Parameters Related to Diodes (in Diode Bridge)
Parameter
Test Condition
Measure
Min Typ
Max
Unit
Voltage Drop at Continuous Current
(50 Hz/60 Hz)
Apply ±dc current limit of
break switches
Forward
Voltage
——
3.5
V
Voltage Drop at Surge Current
Apply ±dynamic current
limit of break switches
Forward
Voltage
—5
V
Parameters Related to Protection SCR
Surge Current
——
A
Gate Trigger Current (Le75181A)*
— — 25 50 mA
Gate Trigger Current (Le75181C)*
— — 33 70 mA
Gate Trigger CurrentTemperature
Coefficient
— — –0.5 — %/°C
Hold Current (Le75181A)
— 70 —
mA
Hold Current (Le75181C)
— 110 —
mA
Gate Trigger Voltage
Trigger current
VBAT – 4
VBAT – 2
V
Reverse Leakage Current
VBAT
— — — 1.0 µA
ON-State Voltage§
0.5 A, t = 0.5 µs
2.0 A, t = 0.5 µs
VON
–3
–5
V
V
* Trigger Current is defined as the minimum current drawn from tip and ring to turn on the SCR. The specification in this data sheet is Gate
Trigger Current, which is defined as the maximum current that can flow into the battery before the SCR turns on.
† Typical at 25 °C
‡ Twice ± dynamic current limit of break switches.
§ In some instances, the typical ON-state voltage can range as low as –25 V.
11
Zarlink Semiconductor Inc.

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