8250ACZUMHB Datasheet PDF - Motorola Semiconductor
Part Number | 8250ACZUMHB | |
Description | KMPC8250ACZUMHB | |
Manufacturers | Motorola Semiconductor | |
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MPC8250EC/D
Rev. 0.9 8/2003
MPC8250
Hardware Specifications
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This document contains detailed information on power considerations, DC/AC electrical
characteristics, and AC timing specifications for the MPC8250 PowerQUICC II™
communications processor.
The following topics are addressed:
Topic
Page
Section 1.1, “Features”
2
Section 1.2, “Electrical and Thermal Characteristics”
5
Section 1.2.1, “DC Electrical Characteristics”
5
Section 1.2.2, “Thermal Characteristics”
10
Section 1.2.3, “Power Considerations”
10
Section 1.2.4, “AC Electrical Characteristics”
11
Section 1.3, “Clock Configuration Modes”
19
Section 1.3.1, “Local Bus Mode”
19
Section 1.3.2, “PCI Mode”
22
Section 1.4, “Pinout”
28
Section 1.5, “Package Description”
53
Section 1.6, “Ordering Information”
56
The MPC8250 is available in two packages—the standard ZU package (480 TBGA) and an
alternate VR package (516 PBGA)—as described in Section 1.4, “Pinout,” and Section 1.5,
“Package Description.” For more information on VR packages, contact your Motorola sales
office. Note that throughout this document references to the MPC8250 are inclusive of its VR
version unless otherwise specified.
NOTE: Document Revision History
Changes to this document are summarized in Table 23 on
page 56.
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Electrical and Thermal Characteristics
•
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– Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN
primary rate, Motorola interchip digital link (IDL), general circuit interface (GCI), and
user-defined TDM serial interfaces
— Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs,
SCCs, SMCs, and serial channels
— Four independent 16-bit timers that can be interconnected as two 32-bit timers
PCI bridge
— PCI Specification Revision 2.2 compliant and supports frequencies up to 66 MHz
— On-chip arbitration
— Support for PCI to 60x memory and 60x memory to PCI streaming
— PCI Host Bridge or Peripheral capabilities
— Includes 4 DMA channels for the following transfers:
– PCI-to-60x to 60x-to-PCI
– 60x-to-PCI to PCI-to-60x
– PCI-to-60x to PCI-to-60x
– 60x-to-PCI to 60x-to-PCI
— Includes all of the configuration registers (which are automatically loaded from the EPROM
and used to configure the MPC8265A) required by the PCI standard as well as message and
doorbell registers
— Supports the I2O standard
— Hot-Swap friendly (supports the Hot Swap Specification as defined by PICMG 2.1 R1.0
August 3, 1998)
— Support for 66 MHz, 3.3 V specification
— 60x-PCI bus core logic which uses a buffer pool to allocate buffers for each port
— Makes use of the local bus signals, so there is no need for additional pins
1.2 Electrical and Thermal Characteristics
This section provides AC and DC electrical specifications and thermal characteristics for the MPC8250.
1.2.1 DC Electrical Characteristics
This section describes the DC electrical characteristics for the MPC8250. Table 1 shows the maximum
electrical ratings.
MOTOROLA
MPC8250 Hardware Specifications
5
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