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PDF EXB-V8V103J Data sheet ( Hoja de datos )
| Número de pieza | EXB-V8V103J | |
| Descripción | (EXBx Series) Chip Resistor Array | |
| Fabricantes | Panasonic | |
| Logotipo |  |
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Chip Resistor Array
Chip Resistor Array
Type: EXB1 : 0201 Array
EXB2 : 0402 Array
EXB3 : 0603 Array
EXBN : 0402 Array
EXBV : 0603 Array
EXBS : 0805 Array
n Features
l High density
2 resistors in 0.8 mm ´ 0.6 mm size
4 resistors in 1.4 mm ´ 0.6 mm size
2 resistors in 1.0 mm ´ 1.0 mm size
4 resistors in 2.0 mm ´ 1.0 mm size
8 resistors in 3.8 mm ´ 1.6 mm size
2 resistors in 1.6 mm ´ 1.6 mm size
4 resistors in 3.2 mm ´ 1.6 mm size
4 resistors in 5.1 mm ´ 2.2 mm size
(EXB14V)
(EXB18V)
(EXB24V)
(EXB28V, N8V)
(EXB2HV)
(EXB34V, V4V)
(EXB38V, V8V)
(EXBS8V)
l Improvement of placement efficiency
Placement efficiency of Chip Resistor Array is two, four or eight times of the flat type chip resistor
n Explanation of Part Numbers
1 2 3 4 5 6 7 8 9 10 11
EXBV8V4 7 2 JV
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Product Code
Thick Film
Chip Resistor
Networks
Chip Resistor Array
Type: inches
1 0201 Array
2 0402 Array
3 0603 Array
N 0402 Array
Convex Terminal
V 0603 Array Concave Terminal
S 0805 Array
No. of Terminal
4 4 Terminal
8 8 Terminal
H 16 Terminal
n Construction (Example : Concave Terminal)
Schematics
Isolated
V
type
Resistance Value
The first two digits are
significant figures of
resistance value and
the third one denotes
the number of zeros
following. Jumper is
expressed by R00
Example: 222: 2.2 k 9
Resistance
Tolerance
J ±5 %
0 Jumper
n Schematics
l Isolated type
Packaging Methods
Code
Packaging
Embossed
Nil Carrier Taping
(S8V)
Punched Carrier Taping
X 2 mm pitch
(14V, 18V, 24V, 28V, N8V)
Punched Carrier Taping
V 4 mm pitch
(2HV, 34V, 38V, V4V, V8V)
14V, 24V, 34V, V4V 18V, 28V, N8V, 38V, V8V, S8V
2 resistors
"!
4 resistors
&%$#
Protective coating
Alumina substrate
Thick film
resistive element
Electrode (Outer)
Electrode (Between)
Electrode (Inner)
2HV
8 resistors
$ # " ! '
!"
!"#$%&
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or us
Should a safety concern arise regarding this product, please be sure to contact us immediately.
e.
1 page  
Chip Resistor Array
B=
B=
> @ ?@ ?@ >
(Not to scale)
Type
28V
a
0.40
Dimensions
Unit (mm)
b cd f
0.525 0.25 0.25 1.40
N8V 0.45 to 0.50 0.35 to 0.38 0.25 0.25 1.40 to 2.00
Type
2HV
> @ ? @ ? @ ?@ ?@ ?@ ?@ >
a
1.00
(Not to scale)
Dimensions
Unit (mm)
b
0.425
c
0.25
d
0.25
f
2.00
n Recommended Soldering Conditions
Recommendations and precautions are described below.
l Recommended soldering conditions for reflow
áReflow soldering shall be two times maximum.
áPlease contact us for additional information when you
use in conditions other than those specified.
áPlease measure a temperature of terminations and study
solderability every kind of solder and board, before actual
use.
Peak
Preheating
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Heating
For solder (Example : Sn/Pb)
Temperature
Preheating 140 ¡C to 160 ¡C
Main heating Above 200 ¡C
Peak
235 ± 5 ¡C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free solder (Example : Sn/Ag/Cu)
Temperature
Time
Preheating 150 ¡C to 180 ¡C 60 s to 120 s
Main heating Above 230 ¡C 30 s to 40 s
Peak
max. 260 ¡C
max. 10 s
l Flow soldering
Time
áWe can not recommended the flow soldering, because we are afraid that solder bridge happen.
Cautions for Safety
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip Resistors Array (hereafter called the
Resistors) so as not to damage their electrodes and protective coatings.
Be careful not to misplace the Resistors on the land patterns. Otherwise, solder bridges may be caused.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the Resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the Resistors may be impaired.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the Resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the Resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish the soldering as quickly as possible (within three seconds at 350 ¡C
max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the Resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply a shock to the Resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the Resistors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bend of printed circuit boards in order to protect the Resistors from abnormal stress.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or us
Should a safety concern arise regarding this product, please be sure to contact us immediately.
e.
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| PDF Descargar | [ Datasheet EXB-V8V103J.PDF ] | |
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