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PDF MMBZ15VDLT1 Data sheet ( Hoja de datos )
| Número de pieza | MMBZ15VDLT1 | |
| Descripción | (MMBZ15VDLT1 / MMBZ27VDLT1) Zener Transient Voltage Suppressors | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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MMBZ15VDLT1,
MMBZ27VCLT1
Preferred Devices
40 Watt Peak Power
Zener Transient Voltage
Suppressors
SOT−23 Dual Common Cathode Zeners
for ESD Protection
These dual monolithic silicon zener diodes are designed for
applications requiring transient overvoltage protection capability. They
are intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment and other applications. Their dual junction common
cathode design protects two separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
The MMBZ27VCLT1 can be used to protect a single wire
communication network form EMI and ESD transient surge voltages.
The MMBZ27VCLT1 is recommended by the
Society of Automotive Engineers (SAE), February 2000, J2411
“Single Wire Can Network for Vehicle Applications” specification as
a solution for transient voltage problems.
Specification Features:
• SOT−23 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration
• Working Peak Reverse Voltage Range − 12.8 V, 22 V
• Standard Zener Breakdown Voltage Range − 15 V, 27 V
• Peak Power − 40 W @ 1.0 ms (Bidirectional),
per Figure 5 Waveform
• ESD Rating of Class N (exceeding 16 kV) per the Human
Body Model
• Low Leakage < 100 nA
• Flammability Rating: UL 94 V−O
• Pb−Free Packages are Available
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
http://onsemi.com
1
2
PIN 1. ANODE
2. ANODE
3. CATHODE
3
3
1
2
SOT−23
CASE 318
STYLE 9
MARKING
DIAGRAM
XXX MG
G
1
xxx = 15D or 27C
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
MMBZ15VDLT1 SOT−23 3000/Tape & Reel
MMBZ15VDLT1G SOT−23 3000/Tape & Reel
(Pb−Free)
MMBZ15VDLT3 SOT−23 10,000/Tape & Reel
MMBZ15VDLT3G SOT−23 10,000/Tape & Reel
(Pb−Free)
MMBZ27VCLT1 SOT−23
MMBZ27VCLT1G SOT−23
(Pb−Free)
3000/Tape & Reel
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2005
July, 2005 − Rev. 7
1
Publication Order Number:
MMBZ15VDLT1/D
1 page  
MMBZ15VDLT1, MMBZ27VCLT1
PACKAGE DIMENSIONS
D
3
E HE
12
e
A
b A1
SOT−23 (TO−236)
CASE 318−08
ISSUE AL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
LC
MILLIMETERS
DIM MIN
NOM MAX
A 0.89
1.00
1.11
A1 0.01
0.06
0.10
b 0.37
0.44
0.50
c 0.09 0.13 0.18
D 2.80
2.90
3.04
E 1.20
1.30
1.40
e 1.78 1.90 2.04
L 0.35
0.54
0.69
H E 2.10 2.40 2.64
STYLE 9:
PIN 1. ANODE
2. ANODE
3. CATHODE
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.014
0.083
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.021
0.094
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.029
0.104
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
0.9
0.035
2.0
0.079
0.8
0.031
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MMBZ15VDLT1.PDF ] | |
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