A1280A-xxxx Datasheet PDF - Actel
| Part Number | A1280A-xxxx | |
| Description | (A1225A - A1280A) FPGAs | |
| Manufacturers | Actel | |
| Logo |  |
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There is a preview and A1280A-xxxx download ( pdf file ) link at the bottom of this page. Total 38 Pages | ||
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v4.0.1
ACT™ 2 Family FPGAs
Features
• Up to 8000 Gate Array Gates
(20,000 PLD equivalent gates)
• Replaces up to 200 TTL Packages
• Replaces up to eighty 20-Pin PAL® Packages
• Design Library with over 500 Macro Functions
• Single-Module Sequential Functions
• Wide-Input Combinatorial Functions
• Up to 1232 Programmable Logic Modules
• Up to 998 Flip-Flops
• Datapath Performance at 105 MHz
• 16-Bit Accumulator Performance to 39 MHz
• Two In-Circuit Diagnostic Probe Pins Support Speed
Analysis to 50 MHz
• Two High-Speed, Low-Skew Clock Networks
• I/O Drive to 10 mA
• Nonvolatile, User Programmable
• Logic Fully Tested Prior to Shipment
• 1.0-micron CMOS Technology
Product Family Profile
Device
A1225A
A1240A
A1280A
Capacity
Gate Array Equivalent Gates
PLD Equivalent Gates
TTL Equivalent Packages
20-Pin PAL Equivalent Packages
2,500
6,250
DataSheet46U3.com
25
4,000
10,000
100
40
8,000
20,000
200
80
DataShee
Logic Modules
S-Modules
C-Modules
451 684 1,232
231 348 624
220 336 608
Flip-Flops (maximum)
382 568 998
Routing Resources
Horizontal Tracks/Channel
Vertical Tracks/Channel
PLICE Antifuse Elements
36
15
250,000
36
15
400,000
36
15
750,000
User I/Os (maximum)
Packages1
Performance2
16-Bit Prescaled Counters
16-Bit Loadable Counters
16-Bit Accumulators
83
100 CPGA
100 PQFP
100 VQFP
84 PLCC
105 MHz
70 MHz
39 MHz
104
132 CPGA
144 PQFP
176 TQFP
84 PLCC
100 MHz
69 MHz
38 MHz
140
176 CPGA
160 PQFP
176 TQFP
84 PLCC
172 CQFP
85 MHz
67 MHz
36 MHz
Notes:
1. See the “Product Plan” on page 3 for package availability.
2. Performance is based on ‘–2’ speed devices at commercial worst-case operating conditions using PREP Benchmarks, Suite #1, Version 1.2,
dated 3-28-93, any analysis is not endorsed by PREP.
DataSheet4U.com
December 2000
DataSheet 4 U .c©o2m000 Actel Corporation
DataSheet4U.com
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ACT™ 2 Family FPGAs
Package Thermal Characteristics
The device junction to case thermal characteristic is θjc,
and the junction to ambient air characteristic is θja. The
thermal characteristics for θja are shown with two different
air flow rates.
Maximum junction temperature is 150°C.
A sample calculation of the absolute maximum power
dissipation allowed for a PQFP 160-pin package at
commercial temperature is as follows:
M------a--x----.---j-u---n---c---t-i--o---n-----t-e---m-----p---.---(--°--C----)----–----M-----a---x---.---c---o---m----m-----e---r--c--i--a---l----t--e---m-----p--.
θja (°C/W)
=
1---5----0--°---C-----–-----7---0---°--C---
33°C/W
=
2.4 W
et4U.com
Package Type
Pin Count
θjc
θja
Still Air
θja
300 ft/min
Ceramic Pin Grid Array
100 5
132 5
176 8
35 17
30 15
23 12
Ceramic Quad Flat Pack
172 8
25 15
Plastic Quad Flat Pack1
100 13 48 40
144 15 40 32
160 15 38 30
Plastic Leaded Chip Carrier2
84 12 37 28
Very Thin Quad Flat Pack3
100 12 43 35
Thin Quad Flat Pack4
176 15 32 25
Notes:(Maximum Power in Still Air)
1. Maximum Power Dissipation for PQFP packages are 1.9 Watts (100-pin), 2.3 Watts (144-pin), and 2.4 Watts (160-pin).
2. Maximum Power Dissipation for PLCC packages is 2.7 Watts.
3. Maximum Power Dissipation for VQFP packages iDs 2a.3taWSathtse.et4U.com
4. Maximum Power Dissipation for TQFP packages is 3.1 Watts.
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
DataShee
Power Dissipation
P = [ICCstandby + ICCactive] * VCC + IOL * VOL * N +
IOH * (VCC – VOH) * M
Where:
ICC standby is the current flowing when no inputs or outputs
are changing.
ICC active is the current flowing due to CMOS switching.
IOL, IOH are TTL sink/source currents.
VOL, VOH are TTL level output voltages.
N equals the number of outputs driving TTL loads to VOL.
M equals the number of outputs driving TTL loads to VOH.
An accurate determination of N and M is problematical
because their values depend on the family type, design
details, and on the system I/O. The power can be divided
into two components: static and active.
Static Power Component
Actel FPGAs have small static power components that
result in lower power dissipation than PALs or PLDs. By
integrating multiple PALs/PLDs into one FPGA, an even
DataSheet4U.com
greater reduction in board-level power dissipation can be
achieved.
The power due to standby current is typically a small
component of the overall power. Standby power is
calculated below for commercial, worst case conditions.
ICC
2 mA
VCC
5.25V
Power
10.5 mW
The static power dissipated by TTL loads depends on the
number of outputs driving high or low and the DC load
current. Again, this value is typically small. For instance, a
32-bit bus sinking 4 mA at 0.33 V will generate 42 mW with
all outputs driving low, and 140 mW with all outputs driving
high. The actual dissipation will average somewhere
between as I/Os switch states with time.
Active Power Component
Power dissipation in CMOS devices is usually dominated by
the active (dynamic) power dissipation. This component is
frequency dependent, a function of the logic and the
external I/O. Active power dissipation results from charging
internal chip capacitances of the interconnect,
unprogrammed antifuses, module inputs, and module
outputs, plus external capacitance due to PC board traces
D a t a S4 Uh. ec eo tm
v4.0 DataSheet4U.com
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Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for A1280A-xxxx electronic component. |
| Information | Total 38 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ A1280A-xxxx.PDF Datasheet ] | |
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