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Número de pieza | NTGS3455T1 | |
Descripción | Power MOSFET -3.5 Amp -30 Volts | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
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No Preview Available ! NTGS3455T1
MOSFET
−3.5 Amps, −30 Volts
P−Channel TSOP−6
Features
• Ultra Low RDS(on)
• Higher Efficiency Extending Battery Life
http://onsemi.com
• Miniature TSOP−6 Surface Mount Package
• Pb−Free Package is Available
V(BR)DSS
RDS(on) TYP
ID Max
Applications
• Power Management in Portable and Battery−Powered Products, i.e.:
mCellular and Cordless Telephones, and PCMCIA Cards
oMAXIMUM RATINGS (TJ = 25°C unless otherwise noted.)
.cRating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
UThermal Resistance
t4Junction−to−Ambient (Note 1.)
Total Power Dissipation @ TA = 25°C
Drain Current
e− Continuous @ TA = 25°C
− Pulsed Drain Current (Tp t 10 µS)
eMaximum Operating Power Dissipation
Maximum Operating Drain Current
hThermal Resistance
Junction−to−Ambient (Note 2.)
STotal Power Dissipation @ TA = 25°C
Drain Current
ta− Continuous @ TA = 25°C
− Pulsed Drain Current (Tp t 10 µS)
Maximum Operating Power Dissipation
aMaximum Operating Drain Current
Operating and Storage Temperature Range
VDSS
VGS
RθJA
Pd
ID
IDM
Pd
ID
RθJA
Pd
ID
IDM
Pd
ID
TJ, Tstg
−30 Volts
"20.0 Volts
62.5
2.0
−3.5
−20
1.0
−2.5
°C/W
Watts
Amps
Amps
Watts
Amps
128 °C/W
1.0 Watts
−2.5
−14
0.5
−1.75
−55 to
150
Amps
Amps
Watts
Amps
°C
.DMaximum Lead Temperature for Soldering TL 260 °C
Purposes for 10 Seconds
1. Mounted onto a 2″ square FR−4 board (1″ sq. 2 oz. cu. 0.06″ thick single
wsided), t t 5.0 seconds.
2. Mounted onto a 2″ square FR−4 board (1″ sq. 2 oz. cu. 0.06″ thick single
wsided), operating to steady state.
w www.DataSheet4U.com© Semiconductor Components Industries, LLC, 2004
1
−30 V
100 mW @ −10 V
P−Channel
1256
DRAIN
−3.5 A
3
GATE
4
SOURCE
4
5
6
3
2
1
TSOP−6
CASE 318G
STYLE 1
MARKING
DIAGRAM
455
x
455 = Device Code
x = Date Code
PIN ASSIGNMENT
Drain Drain Source
6 54
1 23
Drain Drain Gate
ORDERING INFORMATION
Device
Package
Shipping†
NTGS3455T1
TSOP−6 3000 Tape & Reel
NTGS3455T1G TSOP−6 3000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
January, 2004 − Rev. 1
NTGS3455T1/D
1 page NTGS3455T1
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE G
A
L
65 4
S
12 3
B
G
0.05 (0.002)
H
D
M
CJ
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 2.90 3.10 0.1142 0.1220
B 1.30 1.70 0.0512 0.0669
C 0.90 1.10 0.0354 0.0433
D 0.25 0.50 0.0098 0.0197
G 0.85 1.05 0.0335 0.0413
H 0.013 0.100 0.0005 0.0040
J 0.10 0.26 0.0040 0.0102
K 0.20 0.60 0.0079 0.0236
L 1.25 1.55 0.0493 0.0610
M 0 _ 10_ 0 _ 10_
S 2.50 3.00 0.0985 0.1181
STYLE 1:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
http://onsemi.com
5
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet NTGS3455T1.PDF ] |
Número de pieza | Descripción | Fabricantes |
NTGS3455T1 | Power MOSFET -3.5 Amp -30 Volts | ON Semiconductor |
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